System Bits: Nov. 19

By Brian Bailey - 18 Nov, 2013 - Comments: 0

Practical Invisibility Anyone who has read Harry Potter or watched Star Trek knows how powerful invisibility can be—at least in science fiction or the world of magic. But now, two researchers in The Edward S. Rogers Sr. Department of Electrical & Computer Engineering at the University of Toronto have demonstrated an effective invisibility cloak that is thin, scalable and adaptive to diff... » read more

System Bits: Oct. 22

By Ann Mutschler - 22 Oct, 2013 - Comments: 0

Untangled nanotubes Carbon nanotubes are lightweight, strong and conduct electricity, which make them ideal components in new electronics devices, such as tablet computers and touchscreen phones, but cannot be used without being separated out from their natural tangled state. Researchers from Imperial College London have developed a way to unravel and apply carbon nanotubes in the laboratory a... » read more

System Bits: Sept. 10

By Ann Mutschler - 10 Sep, 2013 - Comments: 0

Enabling flexible touchscreens While transparent conductors make touchscreens possible, the cost and the physical limitations of the material these conductors are usually made of are hampering progress toward flexible touchscreen devices but a research collaboration between the University of Pennsylvania and Duke University has shown a new a way to design transparent conductors using metal nan... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: University of Toronto

System Bits: Nov. 19

System Bits: Oct. 22

System Bits: Sept. 10