The Week in Review: IoT

By Jeff Dorsch - 04 May, 2018 - Comments: 0

Cybersecurity Arm this week introduced the Cortex-M35P processor with anti-tampering technology and software isolation. The company also debuted security intellectual property to protect Internet of Things devices from physical cyberattacks and close proximity side-channel attacks. Paul Williamson, Arm’s vice president and general manager of the IoT Device IP line of business, provides more ... » read more

Investors Back IoT Startups

By Jeff Dorsch - 07 Mar, 2018 - Comments: 0

Internet of Things startups took in more than $1.35 billion from corporate and private investors during the latter half of 2017, for a total of about $2.2 billion in the full year. Chicago-based Uptake Technologies, an Industrial IoT startup, had the biggest haul of the year, with $117 million raised in a Series D round, on top of a $90 million Series C round earlier in 2017, bringing its to... » read more

The Week in Review: IoT

By Jeff Dorsch - 01 Dec, 2017 - Comments: 0

Products/Services At this week’s AWS re:Invent conference in Las Vegas, Nevada, Amazon Web Services introduced a number of products and services for the Internet of Things, machine learning, and other areas. These include Amazon FreeRTOS (an operating system for IoT microcontrollers), AWS IoT Device Defender (security management), AWS IoT 1-Click, AWS IoT Device Management, AWS IoT Analytics... » read more

What’s Next for the IoT?

By Jeff Dorsch - 05 Oct, 2017 - Comments: 0

The Internet of Things continues to evolve, attempting to overcome its poor reputation for cybersecurity and making the case for wider adoption, especially by enterprises. Consumer IoT, largely represented in smart-home automation, remains a market being targeted by Amazon, Apple, Google, LG Electronics, Samsung Electronics, and other technology titans. The big bucks are in [getkc id="78" k... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Uptake Technologies

The Week in Review: IoT

Investors Back IoT Startups

The Week in Review: IoT

What’s Next for the IoT?