Distributing Intelligence Inside Multi-Die Assemblies


The shift from SoCs to multi-die assemblies requires more and smarter controllers to be distributed throughout a package in order to ensure optimal performance, signal integrity, and no downtime. In planar SoCs, many of these kinds of functions are often managed by a single CPU or MCU. But as logic increasingly is decomposed into chiplets, connected to each other and memories by  TSVs, hybr... » read more

Less Waste, Faster Results: Why Virtual Twins Are Critical To Future Semiconductor R&D


By Wojciech (Wojtek) Osowiecki, Martyn Coogans, Saravanapriyan Sriraman, Rakesh Ranjan, Yu (Joe) Lu, and David M. Fried The semiconductor industry has long depended on physical experimentation to achieve the precision needed for advanced chip manufacturing. However, this traditional method comes with significant environmental costs—high energy consumption, material waste, and greenhouse ga... » read more

AI Takes Aim At Chip Industry Workforce Training


When all the planned fabs become operational, the semiconductor industry is likely to face a worker shortage of 100,000 each in the U.S. and Europe, and more than 200,000 in Asia-Pacific, according to a McKinsey report. Since the dawn of technology, people have worried that robots, automation, and AI will steal their jobs, but these tools also can be put to use to help fill the chip industry ta... » read more