Startup Funding: Q3 2024

By Jesse Allen - 16 Oct, 2024 - Comments: 0

Numerous new companies burst on the scene in the third quarter of 2024, including startups with plans for customizable RISC-V-based IP for applications from microcontrollers to data centers, high-speed data center interconnects, compute-in-memory LLM inference chips, and surveillance camera SoCs. Although it did not report funding, AheadComputing also launched last quarter to develop RISC-V cor... » read more

Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Startup Funding: September 2021

By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Walden Catalyst Ventures

Startup Funding: Q3 2024

Startup Funding: April 2023

Startup Funding: September 2021

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