Hot Chips 26 wrapped up this week and there were many interesting presentations. One of the many presentations that caught my attention was given by Dave Ditzel, CEO of ThruChip, and is titled, “Low-Cost 3D Chip Stacking with ThruChip Wireless.” The technology is as it sounds — a wireless communication path for stacked die.
The first question you may be asking is, ‘Why would anyone w...
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