Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Sep, 2018 - Comments: 0

Internet of Things Silicon Labs worked with Norway’s Q-Free to create the ParQSense Smart Parking Sensor, which helps drivers find available outdoor parking spaces. ParQSense uses the chip company’s Wonder Gecko wireless microcontroller for connectivity and control. Having gone through pilot testing in the European Union and North America this year, ParQSense is being released for commerci... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 20 Jul, 2018 - Comments: 0

Cybersecurity Rambus signed a patent license agreement with Socionext, a designer of system-on-a-chip devices. Socionext will use Rambus technology in memory controllers, serializers/deserializers, and security applications. Netskope acquired Sift Security, adding 10 technical employees to its headcount of more than 500 people; financial terms weren’t revealed. Sift CEO Neil King was tapp... » read more

The Week in Review: IoT

By Jeff Dorsch - 29 Dec, 2017 - Comments: 0

Equities Zacks Equity Research has a “strong buy” recommendation for shares of Marvell Technology Group, noting the chip company’s improving financial results this year and its competitive position in supplying controllers for solid-state drives. “Furthermore, we believe the elevated demand for Marvell’s 4G LTE products could be a key growth driver. This will be supported by growth f... » read more

The Week In Review: IoT

By Jeff Dorsch - 09 Jun, 2017 - Comments: 0

Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

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Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week in Review: IoT

The Week In Review: IoT

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