The semiconductor IP (SIP) market arose when SIP vendors created IP functions that mirrored those found in the discrete semiconductor market and made those functions available to SoC designers in the form of hard or soft SIP blocks. As the SoC and SIP markets evolved, it was a natural evolution that many discrete SIP functions be converged into larger blocks that mimic system-level functions (i.e. subsystems). This whitepaper discusses how the use IP subsystems to reduce the level of effort designers must expend to create highly complex SoC designs will represent the future of the SoC development in the semiconductor industry.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Continued expansion in new and existing markets points to massive and sustained growth.
Experts at the Table: Designing for context, and geopolitical impacts on a global supply chain.
Funding rolls in for photonics and batteries; 88 startups raise $1.3B.
Disaggregation and the wind-down of Moore’s Law have changed everything.
It depends on whom you ask, but there are advantages to both.
Research shows significant improvement in time to market and optimization of key metrics.
Efficiency is improving significantly, but the amount of data is growing faster.
Some designs focus on power, while others focus on sustainable performance, cost, or flexibility. But choosing the best option for an application based on benchmarks is becoming more difficult.
The clock network is complex, critical to performance, but often it’s treated as an afterthought. Getting this wrong can ruin your chip.
Moving forward will require a fundamental reconsideration of logic.
After years of research, chipmakers have started combining ultra low-power designs with advancements in harvesting technology.
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