Verification reuse; highly paid engineers; M stuff; logos; simpler times; analog PDKs; papers; undersinks; package rules.
By Ed Sperling
Mentor’s Harry Foster rolls out part four of his epic functional verification study, this one on design and verification reuse. If you work in the verification world, pounce.
Cadence’s Brian Fuller looks back over a quarter century of technology—and what the average salary of a hardware design engineer will be in a 15 years: $499,000. But what will a cup of coffee cost?
Synopsys’ Scott Knowlton digs into M-PCIe with M-PHY, including what it is and why it’s important for power and performance.
Dassault SolidWorks’ John Lam gives a brief tutorial about how to replace an uninteresting Viewport compass with something much more interesting, such as your company’s logo.
Mentor’s Colin Walls looks backward to a simpler time, when at least code writers didn’t have to worry about power. Simpler, maybe, but it was never actually easy.
Cadence’s Richard Goering shines a spotlight on a custom/analog deal with TSMC. The foundry will provide SKILL-based PDKs for its 16nm finFET process. TSMC also is upping its use of Cadence’s Virtuoso to design its own IP.
Synopsys’ Mick Posner points to a paper from Broadcom’s Paul Robertson and Synopsys’ Andy Jolley about complex SoC prototyping using an FPGA protyping board. The paper won a “Best of SNUG” award.
Mentor’s Robin Bornoff digs into heat flow paths, undersinking, pads and vias in part three of his thermal analysis study.
Cadence’s Team Allegro looks at how to confidently tweak IC package design rules. There’s a video tutorial to go with it.
Increasing complexity, disaggregation, and continued feature shrinks add to problem; oversight is scant.
Academia, industry partnerships ramp to entice undergrads into hardware engineering.
Packaging and inspection companies draw funding; 124 startups raise over $2.3 billion.
Pitches continue to decrease, but new tooling and technologies are required.
Buried features and re-entrant geometries drive application-specific metrology solutions.
While terms often are used interchangeably, they are very different technologies with different challenges.
Technology and business issues mean it won’t replace EUV, but photonics, biotech and other markets provide plenty of room for growth.
Commercial chiplet marketplaces are still on the distant horizon, but companies are getting an early start with more limited partnerships.
Existing tools can be used for RISC-V, but they may not be the most effective or efficient. What else is needed?
How customization, complexity, and geopolitical tensions are upending the global status quo.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
Key pivot and innovation points in semiconductor manufacturing.
Tools become more specific for Si/SiGe stacks, 3D NAND, and bonded wafer pairs.
Leave a Reply