August 2012 - Semiconductor Engineering


Computational Lithography


Computational lithography has become an integral part of design since the 130 nm process node. New techniques continue to be developed to extend the steady node shrink year after year. To download this white paper, click here. » read more

Experts At The Table: Stacked Die Reality Check


By Ed Sperling Semiconductor Manufacturing & Design sat down with Sunil Patel, principal member of the technical staff for package technology at GlobalFoundries; Steve Pateras, product marketing director at Mentor Graphics; Steve Smith, senior director of platform marketing at Synopsys; Thorsten Matthias, business development director at EVGroup; and Manish Ranjan, vice president of market... » read more

Experts At The Table: FPGA Prototyping Issues


By Ed Sperling System-Level Design sat down to discuss challenges in the FPGA prototyping world with Troy Scott, product marketing manager at Synopsys; Tom Feist, senior director of marketing at Xilinx; Shakeel Jeeawoody, vice president of marketing at Blue Pearl Software; and Ralph Zak, business development director at EVE. What follows are excerpts of that discussion. SLD: Where are the ... » read more

Inflection Points Ahead


By Ed Sperling Engineering challenges have existed at every process node in semiconductor designs, but at 20nm and beyond, engineers and executives on all sides of the industry are talking about inflection points. An inflection point is literally the place where a curve on a graph turns down or up, but in the semiconductor industry it’s usually associated with the point at which a progres... » read more

Dealing With Test More Effectively


By Ed Sperling Shrinking geometries are starting to have the same effect on test as they are on other parts of an SoC, with the focus shifting from area to leakage, heat, noise, signal integrity, and the impact on overall system performance. The warning that design teams have to consider test much earlier in the design was issued to chipmakers years ago and largely ignored. At 28nm that war... » read more

Experts at the Table: Stacking the Deck


By Ann Steffora Mutschler System-Level Design sat down to discuss challenges to 3D-IC adoption with Samta Bansal, product marketing for applied silicon realization in strategy and market development at Cadence; Carey Robertson, product marketing director at Mentor Graphics; Karthik Chandrasekar, member of technical staff in IC Design at Altera; and Herb Reiter, president of EDA2ASIC Consulting... » read more

Best Practices In Verification


By Ann Steffora Mutschler The advent of advanced verification methodologies such as the UVM and its predecessors VMM and OVM has changed the verification landscape in many ways. Design and verification teams used to worry about simulator performance (i.e., how fast the simulator runs a particular test case), but the introduction of constrained-random stimulus and functional coverage and associ... » read more

Being Different Is Bad


By Ann Steffora Mutschler Today’s SoCs contain as much as 80% existing IP that either has been re-used from previous projects or obtained from a third party. Models are created of this hardware IP, as well as new portions of the design, in order to create a virtual prototype that allows the engineering team to see the complete system by running software and applications. While this a... » read more

ROM Code First


By Achim Nohl Finally, nine months after the next-generation SoC project was kicked off, the first prototype board has finally arrived! There are just six months left to get Android and Linux up and running. Because Android should take full advantage of the latest hardware additions, let’s make sure we get it ported as quickly as possible. Unfortunately, it’s not that easy. Before you c... » read more

From Hype To Reality


By Kurt Shuler My purpose in this article is to explain Gartner Research’s Hype Cycle and relate it to the Technology Adoption Lifecycle popularized by Geoffrey Moore’s book, “Crossing the Chasm.” These two models can be used together to provide a combined picture of market expectations and expected technology adoption rates, but people often get the timeframes and takeaways wrong. So ... » read more

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