August 2012 - Page 2 of 6 - Semiconductor Engineering

Verify This
By Frank Ferro - 23 Aug, 2012 - Comments: 0

By Frank Ferro Verify this? No, New Jersey in me is not coming out. This is not a pejorative; it is simply a request and a question. It is a request by SoC designers to the verification team. It is also the verification’s team response when they realize the enormity of the task: “You want me to verify this?” As I continue the discussion on the use of System IP for SoC design, one of ... » read more

Designing In The Rain
By Jon McDonald - 23 Aug, 2012 - Comments: 0

By Jon McDonald Recently I was running some errands on my motorcycle when I got caught in the rain. Living in Florida, this is a fairly common summer occurrence. Generally, as long as it’s not too much of a deluge, I can continue through to my destination and dry off when I arrive. I always get concerned looks from those going by in their enclosed vehicles—from some, “concerned” mig... » read more

Who Owns What And Why
By Ed Sperling - 23 Aug, 2012 - Comments: 0

Who’s calling the shots these days—and how long they’ll continue calling the shots—is turning out to be as much conjecture as playing the futures exchange. There are so many changes underway that even engineers are crossing boundaries no one ever expected and ending up in companies outside of IC design or moving from seemingly far afield into the design world. Still, there are some c... » read more

Interface Additions To The e Language For Effective Communication With SystemC TLM 2.0 Models
By Various Writers - 23 Aug, 2012 - Comments: 0

The last several years have seen strong adoption of transaction-level models using SystemC TLM 2.0. Those models are used for software validation and virtual prototyping. For functional verification, TLMs have a number of advantages—they are available earlier, they allow usersto divide their focus on verifying functionality and protocol/timing details, they enable higher level reuse, and they... » read more

FPGA Design And Verification in Mechatronic Applications
By Various Writers - 23 Aug, 2012 - Comments: 0

The biggest challenge in using FPGA devices may be one of methodology. FPGA designers are familiar with HDL-based requirements-driven design methodologies for digital electronics. But how can requirements be expressed for a system that, while it contains digital elements, is fundamentally non-digital? Fortunately an executable HDL exists that extends the capabilities of the digital VHDL languag... » read more

Yikes! Why Is My SystemVerilog Testbench So Slooooow?
By Various Writers - 23 Aug, 2012 - Comments: 0

It turns out that [gettech id="31023" comment="SystemVerilog"] != [gettech id="31017" comment="verilog"]. OK, we all figured that out a few years ago as we started to build verification environments using [gettech id="31026" comment="IEEE 1800"] SystemVerilog. While it did add design features like new ways to interface code, it also had verification features like classes, dynamic data types, ... » read more

Mixed-Signal IP Design Challenges In 28nm Process And Beyond
By Various Writers - 23 Aug, 2012 - Comments: 0

As process technologies continue to scale aggressively, it is becoming more challenging when developing high-quality, high-speed mixed-signal IP. Specifically, the 28-nm process poses some unique challenges not found in 65-nm and 40-nm technology processes. This paper discusses the low power requirements found in 28-nm processes and addresses issues associated with the aggressive scaling of ... » read more

Development of Complex Multicore Systems: Tracing Challenges and Concept (Part One)
By Various Writers - 23 Aug, 2012 - Comments: 0

This white paper is the first paper of a two-part Mentor Embedded multicore white paper series. In this paper, the challenges software developers face when developing, debugging, and validating software applications for a complex multicore system will be discussed. The paper also highlights some of the questions around hardware resource usage, tracing aids, tracing domains, and concepts for col... » read more

The Seven Layers Of Hardware-Software Debug
By Frank Schirrmeister - 22 Aug, 2012 - Comments: 0

By Frank Schirrmeister [caption id="attachment_9863" align="alignnone" width="639"] Seven Layers of Hardware/Software Debug[/caption] Of course I will be in trouble once this blog is posted. This post is about hardware/software debug,  and I tried to layer a set of different levels for the scope and applicability of debug. I counted seven layers, but I am sure that one may be able to arr... » read more

Why the Big Players Like 450mm Wafers
By Chris Mack - 20 Aug, 2012 - Comments: 0

The reason semiconductor manufacturers like the idea of 450-mm wafers is easy to understand:  bigger wafers should lower the per-chip cost of manufacturing.  But as I mentioned in my last post, this per-chip cost advantage doesn’t apply to lithography.  Each time a wafer size is increased, only the non-litho (per-chip) costs go down, and so lithography costs take up a bigger portion of the... » read more

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