July 2013 - Page 4 of 10 - Semiconductor Engineering

System Bits: July 23
By Ann Mutschler - 23 Jul, 2013 - Comments: 0

Bottom-up nanoribbons Concentric hexagons of graphene grown in a furnace at Rice University represent the first time anyone has synthesized graphene nanoribbons on metal from the bottom up — atom by atom. As seen under a microscope, the layers brought onions to mind, according to Rice chemist James Tour, until a colleague suggested flat graphene could never be like an onion. “So I said,... » read more

Manufacturing Bits: July 23
By Mark LaPedus - 23 Jul, 2013 - Comments: 0

Space Tubes In 2011, NASA produced a material that absorbs on average more than 99% of the ultraviolet, visible, infrared, and far-infrared light that hits it. NASA’s so-called “super-black” material is based on a thin layer of multi-walled carbon nanotubes. Tiny gaps between the nanotubes collect and trap light. The carbon absorbs the photons, preventing them from reflecting off surf... » read more

Why Should A Decision Be Delayed?
By Jon McDonald - 22 Jul, 2013 - Comments: 0

By Jon McDonald Way back in college when I first learned about “delayed binding” I was absolutely ecstatic. In its most general interpretation this is not just a software concept. It’s a way of life. The important part of the concept is to understand that a decision or an action should not be taken until it needs to be taken. This is a relatively simple concept with very broad implica... » read more

The Week In Review: July 22
By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

Experts At The Table: Multi-Core And Many-Core
By Ed Sperling - 21 Jul, 2013 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Naveed Sherwani, CEO of Open-Silicon; Amit Rohatgi, principal mobile architect at MIPS; Grant Martin, chief scientist at Tensilica; Bill Neifert, CTO at Carbon Design Systems; and Kevin McDermott, director of market development for ARM’s System Design Division. What follows are excerpts of that conversation. LPE: Computers aren’t gettin... » read more

The Week In Review: July 19
By Ed Sperling - 19 Jul, 2013 - Comments: 0

By Ed Sperling Synopsys rolled out a 28nm data converter IP portfolio for analog-to-digital and digital-to-analog converters, as well as integrated PLLs. Synopsys says the new architecture saves up to 76% of the power and 86% of area. Mentor Graphics added intelligent software-driven verification to its functional verification platform. New is the ability to automatically generate embedded ... » read more

Experts At The Table: Who Pays For Low Power?
By Ed Sperling - 19 Jul, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss the cost of low power with Fadi Gebara, research staff member for IBM’s Austin Research Lab; David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Aveek Sarkar, vice president of product engineering and support at Apache Design; and Tim Whitfield, director o... » read more

EM Analysis At Advanced Nodes
By Valeriy Sukharev - 19 Jul, 2013 - Comments: 0

EM statistics Almost 50 years ago, James Black demonstrated experimentally that TTF of the metal line stressed by direct current (DC) of density j at the temperature T follows the dependency where k is the Boltzmann constant, and A is the proportionality coefficient, which can depend on line geometry, residual stress, and temperature. Two critical parameters, the current density exponen... » read more

Experts At The Table: SoC Prototyping
By Ann Mutschler - 19 Jul, 2013 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss SoC prototyping with Hillel Miller, pre-silicon verification/emulation manager at Freescale Semiconductor; Frank Schirrmeister, group director, product marketing, system development suite at Cadence; and Mick Posner, director of product marketing at Synopsys. What follows are excerpts of that conversation. SLD: When it comes... » read more

The Alphabet Soup Of New Material Science
By Joanne Itow - 18 Jul, 2013 - Comments: 0

By Joanne Itow Escaping the scorching Arizona temperatures is only one reason why I always look forward to Semicon West. This year’s event was packed with an exceptional variety of activities and vendors. What was the most memorable take-away from the show? There were plenty of panels, presentation and networking discussions on the 450mm wafer transition and EUV. But the biggest thing that I... » read more

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