February 2016 - Page 4 of 10 - Semiconductor Engineering

Power/Performance Bits: Feb. 23
By Jesse Allen - 23 Feb, 2016 - Comments: 0

Apple core batteries Apple waste could help reduce the cost of energy storage, say researchers seeking an improved sodium-ion at the Helmholtz Institute Ulm of Karlsruhe Institute of Technology. Sodium-ion batteries are not only far more powerful than nickel-metal hydride or lead acid accumulators, but also represent an alternative to lithium-ion technology, as the initial materials neede... » read more

A Winning Formula
By Lauro Rizzatti - 22 Feb, 2016 - Comments: 0

It may be fitting that DVCon will be held the same week as Super Tuesday this year, the day when the greatest number of states in the U.S. hold primary elections. Big dollar expenditures and return on investment (ROI) strategies are part of today’s political landscape, as they are with chip design and verification. Missing a delivery window for an electronics device can cost 25% or more o... » read more

How Healthy Is The Chip Market?
By Ed Sperling - 22 Feb, 2016 - Comments: 1

By Ed Sperling & Ann Steffora Mutschler The inclusion of semiconductors in more products across more market segments—many of which historically have not been large consumers of chips—is having a big impact on how they are designed and manufactured, as well as how they are tracked and quantified. In the past, semiconductor sales were so closely tied to the success of personal computers... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Feb, 2016 - Comments: 0

The SPIE Advanced Lithography conference is next week. “The conference should provide an update on extreme ultraviolet lithography (EUV) sentiment from chipmakers such as Intel and TSMC, and we expect generally positive sentiment, which should be good for ASML. Still, high-volume adoption timing of EUV appears to be in the 2020 time frame, so it's very early in the process. We expect a lot of... » read more

The Week In Review: Design/IoT
By Jesse Allen - 19 Feb, 2016 - Comments: 0

Know someone who deserves the Phil Kaufman Award for Distinguished Contributions to EDA? Nominations are open until June 30th. Tools, IP & Chips ARM debuted the Cortex-R8 processor, targeting mass storage devices and future 5G modems with a quad-core configuration and extended low-latency memory. Cadence's schematic design tool, OrCAD Capture, added the capability to export hierarc... » read more

The Big Shift
By Ed Sperling - 18 Feb, 2016 - Comments: 0

The number of chipmakers that truly can differentiate their products by moving to the next process node is falling, and that pool will continue to shrink even further over the next few years. Processor companies such as Intel and IBM always will benefit from scaling and architectural changes. So will GPU companies such as Nvidia, and FPGA vendors such as Xilinx, Microsemi and Altera (now par... » read more

1xnm DRAM Challenges
By Mark LaPedus - 18 Feb, 2016 - Comments: 3

At a recent event, Samsung presented a paper that described how the company plans to extend today’s planar DRAMs down to 20nm and beyond. This is an amazing feat. Until very recently, most engineers believed DRAMs would stop scaling at 20nm or so. Instead, Samsung is ramping up the world’s most advanced DRAMs—a line of 20nm parts—with plans to go even further. Micron and SK Hynix soo... » read more

Consolidation Hits OSAT Biz
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

The outsourced semiconductor assembly and test (OSAT) industry is undergoing a new wave of acquisition activity that will dramatically reshape the packaging and test services markets. [getkc id="83" kc_name="OSATs"] have seen a considerable amount of consolidation over the years, but the industry needs a scorecard to keep track of the recent deals and the resulting fallout. One OSAT deal inv... » read more

Internet of FD-SOI Things?
By Katherine Derbyshire - 18 Feb, 2016 - Comments: 0

Are fully-depleted silicon-on-insulator (FD-SOI) wafers having a moment? Certainly SOI wafers are not new. Soitec’s SmartCut layer transfer technology was patented in 1994, and wafers with implanted oxide layers were available before that. Still, adoption of SOI wafers has been limited. Though they offer improved device isolation and reduced parasitics, the increased wafer cost has been an ob... » read more

Memory Lane: Far From A Leisurely Stroll
By Joanne Itow - 18 Feb, 2016 - Comments: 0

The only semiconductor market segment that has not been taken over by the foundries and still remains dominated by IDMs is the memory sector. The memory market is the last bastion for true IDM manufacturers, who must be savvy in the changing trends in end market applications, advanced technology development, and must still determine how much and when to invest in additional capacity. With on... » read more

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