September 2016 - Page 3 of 11 - Semiconductor Engineering

Making Manufacturing Sustainable For Chips
By Katherine Derbyshire - 28 Sep, 2016 - Comments: 5

There is widespread agreement that fabs and manufacturers in general should operate in a sustainable way, but what exactly does that mean? And what concrete steps can fabs take toward that goal? Once we get past the simplistic “more sustainable is better,” things tend to get pretty fuzzy. Consider the definition of sustainability itself. Corporate responsibility reports and similar docum... » read more

Blog Review: Sept. 28
By Jesse Allen - 28 Sep, 2016 - Comments: 0

Cadence's Paul McLellan provides a glimpse of TSMC's roadmap, including what to look for at 7nm, low-power processes, and the ecosystem around the process. Mentor's Stephen Pateras notes that throughout the evolution of DFT, two rules for success have persisted. Early analysis suggests the largest DDoS attack in history, targeted at security reporter Brian Krebs, may have leveraged flaws ... » read more

System Bits: Sept. 27
By Ann Mutschler - 27 Sep, 2016 - Comments: 0

Memory management scheme accommodates commercial chips In an improvement to a memory management scheme presented last year in which MIT Computer Science and Artificial Intelligence Laboratory researchers unveiled what they said was a fundamentally new way of managing memory on computer chips — one that would use circuit space much more efficiently as chips continue to comprise more and more... » read more

Power/Performance Bits: Sept. 27
By Jesse Allen - 27 Sep, 2016 - Comments: 0

Self-organizing circuits Researchers studying the behavior of nanoscale materials at the Department of Energy's Oak Ridge National Laboratory discovered that due an unusual feature of certain complex oxides called phase separation, individual nanoscale regions can behave as self-organized circuit elements, which could support new multifunctional types of computing architectures. "Within a... » read more

Manufacturing Bits: Sept. 27
By Mark LaPedus - 27 Sep, 2016 - Comments: 0

X-ray movies Leveraging the concepts behind the paradox of Schroedinger’s cat, the Department of Energy’s SLAC National Accelerator Laboratory (SLAC) has made an X-ray movie of the internal workings of a molecule. Specifically, SLAC has taken time-resolved femtosecond x-ray diffraction patterns from a molecular iodine sample. Then, researchers created a movie of intramolecular motion wi... » read more

Think Globally, Act Globally
By Katherine Derbyshire - 26 Sep, 2016 - Comments: 1

For the last several months, I’ve been working on a series of articles about sustainable manufacturing in the semiconductor industry. How can we, as an industry, reduce our environmental footprint? It’s a big topic, and it’s been challenging to find concrete examples of ways fabs can reduce power consumption, water consumption, and greenhouse gas emissions. I’ll address these topics in ... » read more

Smartphone Security: For Your Eyes Only
By Adrienne Downey - 26 Sep, 2016 - Comments: 0

Fans of the Olympics here in the United States were treated to a great Samsung commercial throughout the broadcast. The commercial stars the genius, multi-award-winning actor Christoph Waltz, showing how Americans can multitask with the amazing new Galaxy Note7. Yes, THAT Galaxy Note7. The 90-second long commercial is a delight to watch, but it must have cost Samsung some serious bucks to produ... » read more

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Sep, 2016 - Comments: 0

Fab tools and T&M Applied Materials and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), have announced a five-year extension of their R&D collaboration at the Centre of Excellence in Advanced Packaging in Singapore. The organizations will expand the scope of their R&D collaboration to focus on advancing fan-out wafer... » read more

The Week In Review: IoT
By Jeff Dorsch - 23 Sep, 2016 - Comments: 0

Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

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