June 2017 - Page 4 of 12 - Semiconductor Engineering


Connecting The Car


K. Charles Janac, chairman and CEO of ArterisIP, sat down with Semiconductor Engineering to discuss changes in automotive and how the connected car will affect chip design and a multitude of other markets. What follows are excerpts of that conversation. SE: What is the biggest change you're seeing in semiconductors? Janac: The really big change is that mobility is flattening out. The mark... » read more

Verification Unification


Semiconductor Engineering brought together industry luminaries to initiate the discussion about the role that formal technologies will play with Portable Stimulus and how it may help to bring the two execution technologies closer together. Participating in this roundtable are Joe Hupcey, verification product technologist for [getentity id="22017" e_name="Mentor, a Siemens Business"]; Tom Fitzpa... » read more

Tuesday At DAC


Accellera got everyone out of bed early this morning to talk about the just announced early access release of Portable Stimulus. The panel was made up with people from user companies. Semiconductor Engineering will be providing full coverage of this event, but perhaps the important message is that the panelists were eager to get adoption within their companies but knew that there would be chall... » read more

Blog Review: June 21


Mentor's John McMillan looks into the unique form-factors and components influencing IoT PCB designs. Cadence's Paul McLellan notes some big topics at the Samsung Foundry Forum: FD-SOI, embedded MRAM, and which gate-all-around FET architecture may be the winner. Synopsys' Eric Huang has a lighthearted look at why to buy IP versus building it. Rambus' Aharon Etengoff points to another U... » read more

NAND Market Hits Speed Bump


Demand for NAND flash memory remains robust due to the onslaught of data in systems, but the overall NAND flash market is stuck in the middle of a challenging period beset by product shortages, supply chain issues and a difficult technology transition. Intel, Micron, Samsung, SK Hynix and the Toshiba/Western Digital duo continue to ship traditional planar NAND in the market, but this technol... » read more

Manufacturing Bits: June 20


Solar cell metrology Using atomic force microscopy (AFM), the National Institute of Standards and Technology (NIST) has developed a pair of novel techniques to measure the chemical compositions and defects in solar cells. The new techniques will give researchers insights into a thin-film solar cell material called cadmium telluride. The technology will also suggest ways to boost the efficie... » read more

Monday At DAC


The 54th DAC got started today in a very steamy Austin. While we may be a maturing industry, there is certainly no indications that the people within the industry have given up or intend to take it easy. The event really got started late Sunday when Laurie Balch, chief analyst for Gary Smith EDA, delivered her message. She said that the focus is becoming the verticals. "This change in focus is ... » read more

System Bits: June 20


The case against general-purpose processors With a large number of emerging applications such as implantables, wearables, printed electronics, and IoT have ultra-low area and power constraints, and these applications relying on ultra-low-power general purpose microcontrollers and microprocessors, there are drawbacks, researchers at the University of Illinois and the University of Minnesota rem... » read more

Power/Performance Bits: June 20


Batteries from scrap metal Scientists at the Chinese Academy of Sciences and Jilin University found a method to transform rusty stainless steel mesh into electrodes with outstanding electrochemical properties that make them ideal for potassium-ion batteries. The rust is converted directly into a compact layer with a grid structure that can store potassium ions. A coating of reduced graphite... » read more

Tech Talk: 7nm Power


Annapoorna Krishnaswamy, lead applications engineer at ANSYS, talks with Semiconductor Engineering about power-related changes at 7nm and what engineering teams need to watch out for as they move down to the latest process technology. https://youtu.be/Ym46ssJPeHM » read more

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