Advanced Packaging: A Curse Or A Blessing For Trustworthiness?

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and critical infrastructure. These sectors depend on electronic systems that are not only powerful but also absolutely reliable and, above all, secure. This represents a major challenge, as the increasing complexity of systems opens up new potential avenues of attack. The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and risks.

While in the past the trend was toward more and more integration on a single circuit, we are now seeing a shift toward solutions realized through advanced packaging. The term “advanced packaging” includes various technologies, such as “antenna in package” (AiP), heterogeneous integration (e.g., by means of chiplets), or the integration of optical components. These technologies make it possible to bundle ever more functionality on less and less space, meaning electronic systems can become smaller, more powerful, and more energy efficient. However, this high density of components also harbors new security risks.

The more components there are in a system, the more components can potentially be compromised. Each individual component might represent a security vulnerability for attackers to exploit. Moreover, additional attack possibilities arise during the assembly process. In advanced packaging, several components are connected together, which increases the risk of tampering or unauthorized access during production or assembly. These additional target areas require new security strategies and testing methods.

However, advanced packaging offers not only new challenges but also opportunities to increase the trustworthiness of electronic systems. One promising approach is known as split manufacturing. In split manufacturing, the security-critical functionality of a system is deliberately distributed across different circuits. No single circuit is capable of executing the entire system; the full functionality is activated only when the individual circuits are joined together. This process can be carried out at a particularly trustworthy location, which minimizes the risk of manipulation during production.

The advantage of split manufacturing is that the security-relevant functionality is activated only when the system is finally assembled. As the individual parts can’t function without the others, the likelihood of a system being compromised while it is being manufactured is significantly reduced. This approach ensures that even if attackers have access to a part of the system, they cannot manipulate the system as a whole. The complete system is finally brought together and activated only at a secure, trustworthy location.

In summary, it can be said that advanced packaging represents a double challenge. On the one hand, the higher number of components brings new security risks that arise during the assembly process and through possible weak points in the components. On the other hand, advanced packaging, particularly in conjunction with methods such as split manufacturing, can also help increase the trustworthiness and security of electronic systems. If used correctly, these technologies offer great potential for minimizing security risks and creating reliable, trustworthy systems that play a key role in critical areas such as the automotive industry and infrastructure.