tag: Fraunhofer IIS EAS

AI Design Reshapes Data Management
By Ann Mutschler - 16 Mar, 2026 - Comments: 0

Key takeaways: Integrating AI into chip workflows is pushing companies to overhaul their data management strategies, shifting from passive storage to active, structured, and machine-readable systems. As training and inference workloads grow, data movement, congestion, and energy efficiency become the dominant challenges, often surpassing raw compute capability. Proprietary and comple... » read more

AI Starting To Simplify Design Of Programmable Logic
By Liz Allan - 26 Feb, 2026 - Comments: 0

Key Takeaways AI/ML and agentic tools are getting better at helping design and compile FPGAs, but downstream programming is slower to benefit. FPGAs historically have been designed using Verilog or VHDL, but higher-level languages could push more intelligence into compilers. ML tools can also help with mixed-signal co-design by automatically tuning DSP algorithms based on analog simu... » read more

Minimum Energy Per Query
By Brian Bailey - 12 Feb, 2026 - Comments: 1

Key Takeaways Extracting heat from a chip faster is a short-term fix to a bigger problem. The longer-term challenge is how to reduce the amount of energy used per query. Data movement, guardbanding, and software inefficiency are key targets for the future. Heat is a serious problem within AI chips, and it is limiting how much processing can be done. The solution is either to... » read more

Chiplet Fundamentals For Engineers: eBook
By Bryon Moyer - 02 Feb, 2026 - Comments: 1

Multi-die assemblies are the next phase of Moore's Law, scaling up and out  to improve performance and add flexibility into designs. By decomposing SoCs into building blocks, yield improves for the individual dies and overall performance increases because a chip is no longer bound by reticle limits. But this is much harder than it sounds. Chiplets don't just snap together like LEGOs, and so... » read more

Will 2026 Be Dominated By AI?
By Brian Bailey - 15 Jan, 2026 - Comments: 0

Many opportunities and problems became highly interlinked in 2025, fueled by the historic growth in everything AI. But how close are we coming to breaking points, and what are people doing to mitigate them? That is the story that will unfold this year. AI's penetration into an increasing number of workloads is placing almost quadratic demands on compute, memory, interconnect, and the archite... » read more

Programmable Chips Evolve For Shifting Needs
By Liz Allan - 23 Dec, 2025 - Comments: 0

ICs and SoCs are utilizing a range of processing elements that allow them to optimize current workloads while hedging their bets for the future. What used to be a simple choice between an ASIC, FPGA, or DSP, has evolved into a mix of processor types and architectures, including varying levels of programmability and customization. Speed is essential, but technology is evolving so quickly that... » read more

AI In A/MS IC Design: Between Buzzword And Productivity Boost
By Benjamin Prautsch - 11 Dec, 2025 - Comments: 0

In the past few years, AI has burst onto the public stage in grand style. This ongoing trend is apparent in the rising number of AI applications in everyday life. But more and more, it can also be seen in a broad range of technical niches, where the main motivation is AI’s promise of continuously increasing efficiency. One such niche that has seen decades of attempts to achieve greater eff... » read more

AI Buildout Makes HPC Simulation More Challenging
By Ann Mutschler - 11 Dec, 2025 - Comments: 0

Simulations of semiconductors and systems are becoming bigger, more complex, and increasingly necessary, mirroring everything that is happening to the hardware itself — particularly in AI data centers. The move beyond monolithic chips to multi-die assemblies now requires solving some thorny multi-physics challenges, such as thermal and power delivery, which are increasingly difficult to mo... » read more

AI Plays Multiple Roles Within EDA
By Brian Bailey - 25 Nov, 2025 - Comments: 0

AI's infusion into our world may seem sudden and unexpected, but EDA has been quietly adopting it for more than a decade. What's changed is that it's now becoming more visible, thanks to increasingly powerful large language models (LLMs) and the need to apply them to increasingly challenging multi-physics problems. Two fundamental shifts underlie AI's increasing prominence. First, heat is be... » read more

New Panel Production Efforts Target Interposer Costs
By Bryon Moyer - 20 Nov, 2025 - Comments: 0

The rising cost of increasingly large interposers is spurring renewed interest in panel-level manufacturing, which for years has hobbled along due to the massive and collective effort required by the chip industry to change formats. Several companies are developing their own processes, although there is currently no commercial production. And a new consortium called Joint3, spearheaded by Ja... » read more

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