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The Reliability Of Analog Integrated Circuits And Their Simulation-Aided Verification


Different challenges have to be overcome when designing integrated circuits. Besides schematic and layout design work, verification in view of the non-ideal behavior of circuits and semiconductor technologies in particular is also relevant. The designed circuits have to work at specific operating voltages and within ambient temperature ranges and be robust in terms of process fluctuations ... » read more

Heterogenous Integration Creating New IP Opportunities


The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

Using AI To Speed Up Edge Computing


AI is being designed into a growing number of chips and systems at the edge, where it is being used to speed up the processing of massive amounts of data, and to reduce power by partitioning and prioritization. That, in turn, allows systems to act upon that data more rapidly. Processing data at the edge rather than in the cloud provides a number of well-documented benefits. Because the physi... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

Variation Making Trouble In Advanced Packages


Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go wrong and when. Concerns about variation traditionally have been confined to the most advanced nodes, where transistor density is highest and where manufacturing processes are still being fine-t... » read more

Can Analog Make A Comeback?


We live in an analog world dominated by digital processing, but that could change. Domain specificity, and the desire for greater levels of optimization, may provide analog compute with some significant advantages — and the possibility of a comeback. For the last four decades, the advantages of digital scaling and flexibility have pushed the dividing line between analog and digital closer ... » read more

Active Learning: Integrating Natural Intelligence Into Artificial Intelligence


Today, very few people would likely deny the fact that data can present major added value for companies. But analyzing data from production processes reveals the incompleteness of data collection and the associated reduced potential of the data that can be leveraged. Typical shortcomings include: Incomplete representation of processes in the dataspace, Inadequate connection of processes... » read more

Machine Learning-Based Optimization Of Chiral Photonic Nanostructures: Evolution- And Neural Network-Based Design


Chiral photonics opens new pathways to manipulate light-matter interactions and tailor the optical response of metasurfaces and -materials by nanostructuring nontrivial patterns. Chirality of matter, such as that of molecules, and light, which in the simplest case is given by the handedness of circular polarization, have attracted much attention for applications in chemistry, nanophotonics and ... » read more

Keeping IC Packages Cool


Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

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