tag: Fraunhofer IIS/EAS

Sensor Requirements For Developing Robust Environment Perception Systems
By Ron Martin - 18 Jul, 2024 - Comments: 0

In recent years, sensor systems for environment perception have become increasingly important – whether for adaptive robotics, automated driving, industrial process and quality control, or condition monitoring. The aim is always to detect and interpret certain environmental characteristics. In doing so, it’s important to choose not only the right algorithm but also the right sensor or senso... » read more

Verification Tools Straining To Keep Up
By Brian Bailey - 01 Jul, 2024 - Comments: 0

Verification engineers are the unsung heroes of the semiconductor industry, but they are at a breaking point and desperately in need of modern tools and flows to deal with the rapidly increasing pressures. Verification is no longer just about ensuring that functionality is faithfully represented in an implementation. That alone is an insolvable task, but verification has taken on many new re... » read more

Validation Of Smart Sensors For AI-Based Condition Monitoring In Industry
By André Schneider - 13 Jun, 2024 - Comments: 0

By André Schneider and Martin Lehmann Industry has challenging requirements for the quality and reliability of the distributed smart sensors used in condition monitoring. As a result of digitalization and the increasing use of AI-based monitoring solutions, we can expect an increase in demand for systematic, efficient design and validation processes. In the future, a product’s journey fro... » read more

Trouble Ahead For IC Verification
By Brian Bailey - 30 May, 2024 - Comments: 0

Verification complexity is roughly the square of design complexity, but until recently verification success rates have remained fairly consistent. That's beginning to change. There are troubling signs that verification is collapsing under the load. The first-time success rate fell (see figure 1) in the last survey conducted by Wilson Research, on behalf of Siemens EDA, in 2022. A new survey ... » read more

Efficient Electronics
By Andy Heinig - 16 May, 2024 - Comments: 0

Attention nowadays has turned to the energy consumption of systems that run on electricity. At the moment, the discussion is focused on electricity consumption in data centers: if this continues to rise at its current rate, it will account for a significant proportion of global electricity consumption in the future. Yet there are other, less visible electricity consumers whose power needs are a... » read more

Challenges With Chiplets And Power Delivery
By Ed Sperling - 15 Apr, 2024 - Comments: 0

Chiplets hold the potential to deliver the same PPA benefits as an SoC, but with many more features and options that are possible on a reticle-constrained die. If chiplets live up to the hype, they will deliver what is essentially mass customization, democratizing and speeding the delivery of complex chips across a broad array of markets. Today, the focus has been on die-to-die interfaces, but ... » read more

Architecting Chips For High-Performance Computing
By Ann Mutschler - 15 Apr, 2024 - Comments: 0

The world’s leading hyperscaler cloud data center companies — Amazon, Google, Meta, Microsoft, Oracle, and Akamai — are launching heterogeneous, multi-core architectures specifically for the cloud, and the impact is being felt in high-performance CPU development across the chip industry. It's unlikely that any these chips will ever be sold commercially. They are optimized for specific ... » read more

Memory On Logic: The Good And Bad
By Brian Bailey - 11 Apr, 2024 - Comments: 0

The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on top of logic. Memory on logic significantly reduces the distance between logic and directly associated memory. This can increase performance by 22% and reduce power by 36%, according to one re... » read more

Using AI/ML To Minimize IR Drop
By Ann Mutschler - 11 Apr, 2024 - Comments: 1

IR drop is becoming a much bigger problem as technology nodes scale and more components are packed into advanced packages. This is partly a result of physics, but it's also the result of how the design flow is structured. In most cases, AI/ML can help. The underlying problem is that moving to advanced process nodes, and now 3D-ICs, is driving current densities higher, while the power envelop... » read more

Trusted Electronics: Current And Future Developments
By Roland Jancke - 11 Apr, 2024 - Comments: 0

In today’s world, we encounter electronics increasingly as complex hardware/software systems, such as those in vehicles, machines, and communication devices. These systems are characterized by dramatic increases in functionality in areas like environment sensing, stages of autonomy, and the installation of future updates. Developing and manufacturing such electronic systems today requires glo... » read more

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