Use the most advanced AI technology to optimize an entire SoC within a single platform with a small design team.
The semiconductor industry is at an inflection point within its history. The latest technological advancements in AI, quantum computing, 5G, virtual and augmented reality, IoT, autonomous driving, and biotechnology have revolutionized the semiconductor industry. The growing demands of AI workloads and sophisticated model training are spurring highly specialized semiconductor chips with intricate functionalities and high-performance compute. The transistor count continues to scale with integration and cutting-edge multi-die architectures. Instead of one core, there are eight cores. Instead of having just CPUs, there are neural engines, GPUs, and more. Using the most advanced process nodes, achieving lowest power, highest performance, and smallest possible die size, along with the shortest time to market are some of the most important factors for semiconductor companies to consider in this fast-paced, consumer-driven environment.
Naturally, the question arises as to how do we sustain this massive outburst of demand for complex semiconductor content. The industry is grappling with accelerated design cycles and a shortage of design experts. Although change is hardly new within the semiconductor landscape, the recent burgeoning technologies require a more automated approach. EDA has been at the forefront in making chip design easier and enhancing productivity. The next major frontier is agentic AI automation, which aims to meet this aggressive growth by elevating performance and productivity to new heights.
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