The difference is often a matter of predictive maintenance.
Applied Materials, the innovator of the SmartFactory Rx suite of software products, is taking the lead on leveraging Industry 4.0 principles and technologies, such as Industrial Internet of Things (IIoT) and advanced analytics, to
optimize manufacturing process performance, asset utilization, and supply chain. SmartFactory Rx Analytics & Control (A&C) collects real-time data from interconnected sensors and learns equipment behavioral patterns using machine learning techniques, connecting physical objects to a digital world. With such a cyber-physical system, process and condition monitoring can be fully integrated on one platform for operators to monitor process performance and for maintenance users to analyze equipment health. This integrated analytics and maintenance system enables maintenance to be accurately predicted and prescribed to prevent unexpected machine breakdowns, improve asset utilization, and reduce costs.
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100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Lots of unknowns will persist for decades across multiple market segments.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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