Smart Test Collides With The Data Chain


Key Takeaways: The promise of smart test is a data-chain problem before it is an algorithm problem. A device can pass every checkpoint and still carry a latent defect the test record never captured. As test grows more adaptive, the validity of the measurement environment matters as much as the measurement itself. For years, the test roadmap has pointed toward more adaptive f... » read more

Advancing Autonomous Fabs


The semiconductor industry is entering a critical transition phase toward Autonomous Semiconductor Fabs, driven by escalating process complexity, increasing equipment costs, and heightened demands for operational stability. In this environment, preventive maintenance (PM) is no longer a peripheral operational function but a central determinant of equipment availability, productivity, and manufa... » read more

Zero-Trust Data Sharing Architectures Redefining Chip Manufacturing


Real-time security clearances are becoming increasingly common in the manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat. Data security is a well-known issue in semiconductor manufacturing, but much of it is based on an outdated approach. In its place, zero-trust architectures [1] are now a requirement for new equipment and ins... » read more

The Real-World Impact Of Silicon Lifecycle Management On Chip Architectures


Silicon lifecycle management (SLM) is transforming chip architectures, empowering designers to build smarter, more resilient, and secure semiconductor devices by leveraging data from manufacturing to end of life in the field. That data can be used to improve future designs, reduce margin, and continuously optimize performance and power efficiency throughout a chip's lifetime. Moreover, under... » read more

Functional Safety Insights For Today’s Automotive Industry


As cars have evolved into rolling computing platforms, vehicle safety now extends well beyond the traditional seat belt. While they still take us to the grocery store, they also integrate advanced technology, enabling the rapid fusion of multimodal data through edge devices such as sensors and actuators. Modern vehicles offer unprecedented safety, but they can contain between one to three th... » read more

Aftermarket Sensors Boost Yield In Wafer Fabs


Third-party sensors are being added into fab equipment to help boost yield and to extend the life of expensive tools, supplementing the sensors that come with equipment used in fabs. The data gleaned from those sensors has broad uses within the fab. It can measure process module performance, identify defect sources, and alert fabs of impending equipment failure. And when coupled with machine... » read more

Are You Ready For HBM4? A Silicon Lifecycle Management (SLM) Perspective


Many factors are driving system-on-chip (SoC) developers to adopt multi-die technology, in which multiple dies are stacked in a three-dimensional (3D) configuration. Multi-die systems may make power and thermal issues more complex, and they have required major innovations in electronic design automation (EDA) implementation and test tools. These challenges are more than offset by the advantages... » read more

Effective Monitoring, Test, and Repair of Multi-Die Designs


Despite clear advantages, there are numerous new challenges that need to be addressed for successful multi-die realization. The multi-die test challenges include: Bare chiplet level (pre-bond) Probe, dedicated/functional pads for test Test, diagnosis, and repair Interconnects (mid/post-bond) Die-to-die test access Lane test, diagnosis, and repair Multi-die ... » read more

Real-Time Safety Monitoring for Predictive and Prescriptive Maintenance in Advanced Automotive Electronics


Software Defined, Electric, and Autonomous vehicles are driving new roadmaps for advanced electronics. Centralized architectures have introduced cutting-edge ECUs and SOCs. Coupled with stringent standardization, automotive manufacturers and OEMs are tasked with achieving functional safety in an ever-developing landscape. Maintaining safety standards without compromising performance and cos... » read more

Precise Control Needed For Copper Plating And CMP


Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in order to extend the usefulness of copper interconnects. Copper is well understood and easy to work with, but it is running out of steam. At 5nm and below, copper plating tools are struggling to... » read more

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