Annapoorna Krishnaswamy

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Annapoorna Krishnaswamy is a product marketing manager for the Semiconductor Business Unit at ANSYS.

Author's Latest Posts

Getting Ahead With Early Power Analysis
By Annapoorna Krishnaswamy - 09 Aug, 2018 - Comments: 0

Today’s mobile applications need to cater to a broad set of applications. They can be communications-heavy (Bluetooth and GPS), graphics-intensive (streaming 4K videos), or compute-intensive workloads (AR/VR gaming). At the heart of this processing lies the all-powerful mobile processor, which includes a multi-core CPU, GPU, memory and other IP and subsystems for performing a variety of ta... » read more

Beyond Signoff
By Annapoorna Krishnaswamy - 14 Jun, 2018 - Comments: 0

The future of connectivity is very promising - the new era of semiconductors will give rise to transformational products that will enable seamless connectivity with 5G, smarter devices with AI, next generation mobility with autonomous vehicles and immersive experiences with AR and VR. These cutting-edge electronics systems will require the use of advanced sub-16nm SoCs and complex packaging tec... » read more

Early Chip-Package-System Thermal Analysis
By Annapoorna Krishnaswamy - 10 May, 2018 - Comments: 0

Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

Multiphysics Reliability Signoff For Next-Gen Auto Electronics Systems
By Annapoorna Krishnaswamy - 12 Mar, 2018 - Comments: 0

The automotive industry is in the midst of a sea change. Growing market needs for electrification, connectivity on the go, advanced driver assistance systems, and ultimately the goal of autonomous driving, are creating newer requirements and greater challenges. A chassis on four wheels is now fitted with cameras, radar and other sensors, which will be the eyes of the driverless car, as well as ... » read more

Full-Chip Power Integrity And Reliability Signoff
By Annapoorna Krishnaswamy - 09 Nov, 2017 - Comments: 0

As designs increase in complexity to cater to the insatiable need for more compute power — which is being driven by different AI applications ranging from data centers to self-driving cars—designers are constantly faced with the challenge of meeting the elusive power, performance and area (PPA) targets. PPA over-design has repercussions resulting in increased product cost as well as pote... » read more

Improving Automotive Reliability
By Annapoorna Krishnaswamy - 16 Oct, 2017 - Comments: 0

Semiconductor reliability requirements are rapidly evolving. New applications such as ADAS/self-driving cars and drones are pushing the limits for system reliability. A mobile phone that overheats in your pocket is annoying. In automobiles, it's a much different story. Overheating can impact the operation of backup sensors, which alert the driver that a pedestrian or obstacle is behind them.... » read more

Design For Silicon Success At 7nm
By Annapoorna Krishnaswamy - 01 May, 2017 - Comments: 0

Next-generation automotive, mobile and high-performance computing applications demand the use of 7nm SoCs to deliver greater functionality and higher performance at much lower power. According to Gartner, when compared to 16nm/14nm technology, 7nm offers 35% speed improvement, 65% less power, and 3.3X density improvement. Hence, despite a whopping cost of $271M — per Gartner's estimate — to... » read more

IP Design Essentials For Reliability And SoC Integration
By Annapoorna Krishnaswamy - 15 Jan, 2015 - Comments: 0

IP is integral to every SoC design. The need for ubiquitous connectivity has pushed the threshold for content in SoCs even beyond the tenets of Moore’s Law. Technology scaling has not only enabled the delivery of increased performance and reduced power, but also rich content through the integration of a wide range of IPs such as radio devices, CMOS image sensors, MEMs, etc., into a single ... » read more

IP Design Essentials For Power Integrity
By Annapoorna Krishnaswamy - 06 Nov, 2014 - Comments: 0

Smart connectivity is the new mantra of today – the ability to connect to anything, anywhere and at any time. With such technology enablement, low power is not a choice but an expectation. Whether it is a connected device, or a system that is part of the infrastructure, they are driven to integrate various functionality such as high speed computing, high-speed memory, memory interfaces, radio... » read more

Current Generation Of FPGAs Pose New Power And Reliability Challenges
By Annapoorna Krishnaswamy - 07 Nov, 2013 - Comments: 0

Today’s FPGAs are being used in a wide variety of applications such as consumer electronics, computer and storage, automotive electronics, and mission critical applications. The flexibility to configure the device based on its need, the ability to reprogram its functions, and the hardware parallelism it offers to quickly process very large amounts of data are some of the reasons why off-the-s... » read more

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