Author's Latest Posts

Closing The Loop: Meeting High-Frequency Power Demands With Decoupling Capacitors
By Cadence - 06 Jul, 2022 - Comments: 0

The inability to supply adequate power in time can result in intermittent board failure and hours troubleshooting in the lab. Even an IC with ample current supply can experience "power shortage" if the energy needed to transmit the data bitstream isn't available in time. Click here to read more. » read more

Overcoming Signal, Power, And Thermal Challenges Implementing GDDR6 Interfaces
By Cadence - 22 Jun, 2022 - Comments: 0

Graphics processing units (GPUs) and graphics double data rate (GDDR) memory interfaces are essential to graphics cards, game consoles, high-performance computing (HPC), and machine learning applications. These interfaces enable data transfer speeds of over 665GB per second today and will continue to support well over a terabyte per second (TBps) in next-generation GDDR interfaces. Signal integ... » read more

EDA Software Design Flow Considerations For The RF/Microwave Module Designer
By Cadence - 25 May, 2022 - Comments: 0

Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an... » read more

Data Management Position: An Automated Approach to Intelligent PCB Design Data Management
By Cadence - 04 May, 2022 - Comments: 0

The design cycle of electronic devices produces vast amounts of data. From a top-level view, this data can be broken down into basic blocks, including software, circuit board design, mechanical design, and others. These blocks contain extensive and complex information, including the types and amounts of individual data and information files, as well as their hierarchy structure. This data and i... » read more

Advances In EM Analysis And Design Flows For RF System Development
By Cadence - 27 Apr, 2022 - Comments: 0

With the move toward higher frequencies and component densities, RF/mixed signal PCB systems and heterogeneous system-in-package (SiP) technologies are increasingly susceptible to delayed product development turnaround times that threaten delivery schedules. These delays often occur late in development during integration when components that met the design specifications fail to achieve the req... » read more

Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards
By Cadence - 13 Apr, 2022 - Comments: 0

By Martin James, Gary Dick, and Arif Khan, Cadence with Suhas Pai and Brian Rea, Intel The Compute Express Link™ (CXL™) 2.0 specification, released in 2020, accompanies the latest PCI Express (PCIe) 5.0 specification to provide a path to high-bandwidth, cache-coherent, low-latency transport for many high-bandwidth applications such as artificial intelligence, machine learning, ... » read more

Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications
By Cadence - 23 Mar, 2022 - Comments: 0

By Melika Roshandell, Cadence Design overview Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule ef... » read more

RF To mmWave Design For Systems
By Cadence - 23 Feb, 2022 - Comments: 0

RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today’s electronic systems often integra... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design
By Cadence - 09 Feb, 2022 - Comments: 0

In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

Leveraging Multi-Protocol PHY For PCIe To Cope With SoC Design Complexity
By Cadence - 26 Jan, 2022 - Comments: 0

Now in the post-Moore’s Law era, the fast-evolving semiconductor market is continually geared toward higher performance and feature-rich integrated chip (IC) solutions. More functional design blocks integrated with growing interconnections—to not only increase the overall throughput but also expand the I/O connectivity—resulted in a more powerful system on chip (SoC). This increasing comp... » read more

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