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Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications

A tool for calculating heat generated by the Joule effect due to high currents.

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By Melika Roshandell, Cadence

Design overview
Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule effect due to the high currents flowing through the copper from the voltage regulator to the sinks. These Celsius Thermal Solver capabilities are ideal for applications like DC/DC converter PCB designs, switch-mode power supply (SMPS) PCB designs, motor-controlling PCB designs, and other high-current automotive and industrial applications.

The Cadence Celsius Thermal Solver provides unique capabilities for package and PCB designers that enable thermal-aware performance optimization in the early stages of design. In addition to achieving unprecedented 10X speed without sacrificing accuracy, the software’s unique electrothermal co-simulation technology not only reduces package and PCB design cycles, but also uncovers potential thermal reliability and performance risks. This white paper demonstrates a high-current motor controlling PCB solution for the automotive industry that utilizes the Celsius Thermal Solver to optimize the PCB design, as well as the electrothermal co-simulation capability to uncover thermal issues in the leadframe package.

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