SiC Growth For EVs Is Stressing Manufacturing

The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing awareness about just how immature SiC technology is and how much work still needs to be done — and how quickly that has to happen. Automakers are pushing heavily into electric vehicles, and t... » read more

Ramping Up Power Electronics For EVs

The rapid acceleration of the power devices used in electric vehicles (EVs) is challenging chipmakers to adequately screen the ICs that power these vehicles.[1] While progress toward autonomous driving is grabbing the public’s attention, the electrification of transportation systems is progressing quietly. For the automotive industry, this shift involves a mix of electronic components. Amo... » read more

Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications

By Melika Roshandell, Cadence Design overview Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule ef... » read more

The Role of InGaN Quantum Barriers in Improving the Performance of GaN-based Laser Diodes

Abstract: "In this work, different aspects which have influences on device performance of blue laser diodes (LDs) when using InGaN instead of GaN as quantum barrier (QB) layers are investigated theoretically and experimentally. In the modeling calculation, it is found that the threshold current of LDs with InGaN QB layers is reduced obviously, but the slope efficiency is not largely improved... » read more

System Electrothermal Transient Analysis of A High Current (40A) Synchronous Step Down Converter

Authors: Rajen Murugan, Jie Chen, and Todd Harrison of Texas Instruments, Inc. and C.T. Kao and Nathan Ai of Cadence Design Systems; from Proceedings of the ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, IPACK2019, October 7-9, 2019, Anaheim, CA, USA In this paper, we detailed the system electrothermal transi... » read more