Author's Latest Posts


Back-End-of-Line (BEOL) Virtual Patterning With SEMulator3D


Interconnect requirements for the 22nm technology node and beyond, driven by shrinking FEOL geometry, push the limits of unit process tools for BEOL as well as FEOL. Lengthy and costly in-fab experiments are required to ensure that the integrated BEOL process meets local performance and cross-wafer uniformity requirements. Virtual fabrication experiments conducted with SEMulator3D can reduce th... » read more

Virtual Fabrication For MEMS Process Development


MEMS fabrication and design are closely coupled, such that design changes could significantly alter the process flow and vice versa. For instance, setting device parameters such as drive capacitance, deflection distance, or proof mass size directly affects the choice of film thickness, etch rate, sidewall profile and so forth. Typically, this requires multiple iterations of the MEMS design/proc... » read more

Back-End-of-Line (BEOL) Metallization


Physical Vapor Deposition (PVD) for Back-End-of-Line (BEOL) metallization is being pushed to the limits at the 16-nanometer (nm) technology node and beyond. Extending PVD for metal liner and barrier seed deposition is forcing the process into a narrow window that must be characterized prior to manufacturing introduction. Furthermore, understanding the liner dependency on the trench and via etch... » read more

Fast Analysis Of Acoustic Resonators For The Rapidly Growing Premium RF Filter Market


Acoustic resonator filters have been used in cell phones since the early 2G wireless standard. Now, typical smart phones employ 30 or more filters as mobile carriers push to support more and more data bands as well as Wi-Fi, Bluetooth and GPS. Market pressure for these RF filters to be compact and inexpensive, yet meet the higher performance requirements of the 4G standards, has spurred great i... » read more

Modeling Semiconductor Process Variation


3D semiconductors, 3D NAND Flash, FinFETS and other advanced devices are bringing tremendous opportunities to the semiconductor industry. Unfortunately, these devices are also bringing new design, process and production problems. Process variability has been a major contributor to production delays as feature sizes have decreased and process complexity has increased. Virtual fabrication is a co... » read more

3D NAND Flash Processing


Coventor’s powerful SEMulator3D semiconductor process modeling platform offers a wide range of technology development capabilities for the development of cutting edge 3D NAND Flash Technology. 3D NAND promises high memory cell density with reduced data corruption, but also brings processing challenges. The structural complexity and inherent 3D nature of devices using 3D NAND require a predict... » read more

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