Author's Latest Posts


Changes In Sensors And DSPs


Pulin Desai, group director for product marketing, management and business development at Cadence, talks about why processing is moving closer to the end point, how to save energy through reduced area and sensor fusion, and the impact of specialization, 3D capture and always-on circuits. » read more

Customizing Chips For Power And Performance


Sandro Cerato, senior vice president and CTO of the Power & Sensor Systems Business Unit at Infineon Technologies, sat down with Semiconductor Engineering to talk about fundamental shifts in chip design with the rollout of the edge, AI, and more customized solutions. What follows are excerpts of that conversation. SE: The chip market is starting to fall into three distinct buckets, the e... » read more

3 Technologies That Will Challenge Test


As chips are deployed in more complex systems and with new technologies, it's not clear exactly what chipmakers and systems vendors will be testing. The standard tests for voltage, temperature and electrical throughput still will be needed, of course. But that won't be sufficient to ensure that sensor fusion, machine learning, or millimeter wave 5/6G will be functioning properly. Each of tho... » read more

Making Lidar More Useful


Lidar, one of a trio of “vision” technologies slated for cars of the future, is improving both in terms of form and function. Willard Tu, director of automotive at Xilinx, talks with Semiconductor Engineering about different approaches and tradeoffs between cost, compute intensity and resolution, various range and field of view options, and why convolutional neural networks are so important... » read more

Configuring AI Chips


Change is almost constant in AI systems. Vinay Mehta, technical product marketing manager at Flex Logix, talks about the need for flexible architectures to deal with continual modifications in algorithms, more complex convolutions, and unforeseen system interactions, as well as the ability to apply all of this over longer chip lifetimes. Related Dynamically Reconfiguring Logic A differ... » read more

Monitoring Performance From Inside A Chip


Deep data, which is generated inside the chip rather than externally, is becoming more critical at each new process node and in advanced packages. Uzi Baruch, chief strategy officer at proteanTecs, talks with Semiconductor Engineering about using that data to identify potential problems before they result in failures in the field, and why it's essential to monitor these devices throughout their... » read more

One-On-One: Lip-Bu Tan


Lip-Bu Tan, CEO of Cadence, sat down with Semiconductor Engineering to talk about the impact of massive increases in data across a variety of industries, the growing need for computational software, and the potential implications of U.S.-China relations. What follows are excerpts of that discussion. SE: What do you see as the biggest change for the chip industry? Tan: We're in our fifth g... » read more

Next-Gen SerDes Roadmap


An explosion in data is causing a series of successive bottlenecks in the data center. Priyank Shukla, product marketing manager for high-speed SerDes IP at Synopsys, digs into the performance roadmap for moving data within server racks and between different racks, where the bottlenecks are today, and how they will be addressed in the future. Related SerDes Knowledge Center Top stories... » read more

Recalculating The Cost Of Test


The cost of test is rising. For decades, test was limited to a flat 2% of the cost of designing and manufacturing a chip. Today, no one is quite sure what that cost really is, and there doesn't seem to be any single formula for determining it. In some cases, there isn't even a sense of urgency to finding out. Several significant changes are occurring that make any formula difficult to cal... » read more

Steep Spike For Chip Complexity And Unknowns


Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

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