Dealing with obsolescence through retrofitting.
Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly Quik-Pak), talks with Semiconductor Engineering about why it’s so important to use existing package footprints, what are the challenges in replacing the circuitry inside a package, and which markets are clamoring for this approach.
While terms often are used interchangeably, they are very different technologies with different challenges.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
Key pivot and innovation points in semiconductor manufacturing.
Tools become more specific for Si/SiGe stacks, 3D NAND, and bonded wafer pairs.
Thinner photoresist layers, line roughness, and stochastic defects add new problems for the angstrom generation of chips.
Less precision equals lower power, but standards are required to make this work.
While terms often are used interchangeably, they are very different technologies with different challenges.
Open-source processor cores are beginning to show up in heterogeneous SoCs and packages.
New applications require a deep understanding of the tradeoffs for different types of DRAM.
Open source by itself doesn’t guarantee security. It still comes down to the fundamentals of design.
How customization, complexity, and geopolitical tensions are upending the global status quo.
127 startups raise $2.6B; data center connectivity, quantum computing, and batteries draw big funding.
The industry is gaining ground in understanding how aging affects reliability, but more variables make it harder to fix.
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