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Effects of Size Scaling and Device Architecture on the Radiation Response of Nanoscale MOS Transistors


A new technical paper titled "Perspective on radiation effects in nanoscale metal–oxide–semiconductor devices" was published by a researcher at Vanderbilt University, Nashville, Tennessee. The work was partially supported by the Defense Threat Reduction Agency and by the U.S. Air Force Office of Scientific Research and Air Force Research Laboratory. According to the paper, "this Perspect... » read more

TCAD-Based Radiation Modeling Technique For Reliable Aerospace Chips


By Ian Land and Ricardo Borges We demand a lot from the electronic components that bring our devices and systems to life. This is particularly true when it comes to semiconductors for space applications. From satellites to spacecraft, aerospace and defense equipment must tolerate the most extreme of operating conditions in order to perform their jobs safely and reliably. How do you ensure... » read more

Digital Transformation At The Farnborough Airshow 2022


Alternating every year with the Paris Airshow, the Farnborough Airshow was back to an in-person event this July 2022. It focused on six key themes—space, defense, sustainability, innovation, future flight, and workforce. Within these themes, digitalization and data emerged as very prominent messages. Some of the prototypes and actual devices on display at the event felt like they were taken s... » read more

Verification Management For Aerospace And Defense


This executive brief presents the verification management digital thread. It demonstrates the value of integrated verification and certification for accelerating product delivery in the aerospace and defense industry. Read the brief to learn how you can certify products on schedule and within budget, eliminating the silos in your verification and certification activities. Aircraft certificat... » read more

System Innovation For Aerospace, Defense And Government


Tools for developer and user challenges Performance in a small package — low size, weight and power (SWaP) Long-life and upgradability with high-reliability, security, and safety Reliability in a range of operating environments, from ground to space End-to-end support: from the IoT network edge to the datacenter Process massively parallel sensor data with low latency S... » read more

CFD Playing Increasing Role In Design


With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Materials For The Electrification Of The Powertrain


The challenge for those looking to electrify powertrains in automotive and aerospace applications is essential to solve at both strategic and technical levels. Engineers are on the front line of an electrification revolution that must take place, and materials are evolving quickly to enable this revolution. Finding materials with the right thermal, structural, and electromagnetic properties for... » read more

Radiation Hardening Chips For Outer Space


What’s the difference between radiation tolerant and radiation hardening, and where is each one used? Minal Sawant, director of the aerospace and defense vertical market at Xilinx, talks about different striations in the Earth’s atmosphere, how those various levels can affect radiation, and what impact that has on the functionality of increasingly dense chip circuits over extended periods o... » read more

Open Cavity Plastic Packaging


Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly Quik-Pak), talks with Semiconductor Engineering about why it’s so important to use existing package footprints, what are the challenges in replacing the circuitry inside a package, and which markets a... » read more

Progress And Challenges On The CFD Vision 2030 Roadmap


After a long writing (and longer editing and approval seeking) process, the AIAA's CFD Vision 2030 Integration Committee has published its first update to the Vision's roadmap. This 71 page, thoroughly cited report assesses progress toward the Vision during 2020 and also provides a 5-year look-back. It covers the six domains along which the vision assesses progress in CFD: high performance comp... » read more

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