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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Blog Review: November 15
By Jesse Allen - 15 Nov, 2023 - Comments: 0

Cadence's Neelabh Singh explores the process of lane initialization and link training in bringing up a high-speed link in USB4. Synopsys' Shela Aboud argues that TCAD should be an integral part of an EDA flow as it enhances design technology co-optimization with a way to experiment and determine what works and what doesn’t work at different process nodes using physics-based models. Siem... » read more

Research Bits: November 14
By Jesse Allen - 14 Nov, 2023 - Comments: 0

Solid-state thermal transistor for heat management Researchers from University of California Los Angeles created a stable and fully solid-state thermal transistor that uses an electric field to control a semiconductor device’s heat movement. It is compatible with integrated circuits in semiconductor manufacturing processes. The team’s design incorporates the field effect on charge dynamics... » read more

Startup Funding: October 2023
By Jesse Allen - 08 Nov, 2023 - Comments: 0

Investors are betting heavily on data center technology, with October funding going to companies developing data processing units (DPUs) to accelerate a variety of tasks, a near-memory distributed dataflow architecture for AI, and liquid cooling technology. Much of this is linked to the build-out of the edge, closer to the source of the data than the cloud but not as compute-intensive. Other ... » read more

Blog Review: Nov. 8
By Jesse Allen - 08 Nov, 2023 - Comments: 0

Siemens' Todd Westerhoff takes a look at the three stages of power integrity analysis for PCBs, challenges to board-level signal integrity, and best practices for getting the most accurate estimate of design performance. Synopsys' William Ruby provides a brief overview of the evolution of low-power design techniques and finds opportunities to reduce power and to make chip designs more energy... » read more

Research Bits: November 6
By Jesse Allen - 06 Nov, 2023 - Comments: 0

Fast superatomic semiconductor Researchers from Columbia University created a fast and efficient superatomic semiconductor material based on rhenium called Re6Se8Cl2. Rather than scattering when they come into contact with phonons, excitons in Re6Se8Cl2 bind with phonons to create new quasiparticles called acoustic exciton-polarons. Although polarons are found in many materials, those in Re6Se... » read more

Blog Review: November 1
By Jesse Allen - 01 Nov, 2023 - Comments: 0

Cadence’s Rich Chang finds that although UVM has being used for testbench creation for more than a decade, it is still challenging to debug problems that are inside of UVM testbench. Siemens’ Keith Felton suggests that early analysis in complex advanced packaging flows can enable designers to spot potential issues early to avoid built-in constructs that cause design failures and require ... » read more

Blog Review: October 25
By Jesse Allen - 25 Oct, 2023 - Comments: 0

Synopsys’ Graham Allan looks at enhancements in the LPDDR5X standard, such as a speed increase from 6.4Gbps to 8.5Gbps using the same 1.1V core voltage as LPDDR5 alongside better signal integrity, reliability, and battery efficiency. Cadence’s Krunal Patel examines the essential components and operation of MACsec, a security protocol to ensure the confidentiality and integrity of data tr... » read more

Research Bits: October 24
By Jesse Allen - 24 Oct, 2023 - Comments: 0

Photonic-electronic hardware processes 3D data Researchers from the University of Oxford, University of Muenster, University of Heidelberg, and University of Exeter are developing integrated photonic-electronic hardware capable of processing three-dimensional data, which the team claims boosts data processing parallelism for AI tasks. The researchers added an extra parallel dimension to the... » read more

Blog Review: October 18
By Jesse Allen - 18 Oct, 2023 - Comments: 0

Siemens' Stephen Chavez suggests including analog mixed signal analysis and board level parasitics within the design process from the earliest electrical design stage and throughout final release of the PCB design. Synopsys’ Filip Thoen, Leonard Drucker, and Vivek Prasad highlight how the complexities and interdependencies of multi-die systems create new challenges for software bring-up, a... » read more

Research Bits: October 17
By Jesse Allen - 17 Oct, 2023 - Comments: 0

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

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