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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Blog Review: July 26
By Jesse Allen - 26 Jul, 2023 - Comments: 0

Siemens' Chris Spear shows how to make a group of specialized classes in SystemVerilog. Synopsys' Guy Cortez and Randy Fish consider what a silicon lifecycle management strategy looks like for SoCs deployed in HPC and data center environments. Cadence's Veena Parthan provides a primer on writing Python scripts for Fidelity, including API descriptions and different sets of packages to acce... » read more

Research Bits: July 24
By Jesse Allen - 24 Jul, 2023 - Comments: 0

Protons improve ferroelectric memory Researchers from King Abdullah University of Science and Technology (KAUST), Qingdao University, and Zhejiang University developed a method to produce multiple phase transitions in ferroelectric materials, which could increase storage capacity for neuromorphic memory. The approach uses proton-mediation of the ferroelectric material indium selenide. The r... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jul, 2023 - Comments: 0

Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

Blog Review: July 19
By Jesse Allen - 19 Jul, 2023 - Comments: 0

Siemens' Keith Felton argues that co-design-driven semiconductor package planning and prototyping is critical for design success and points to how interchange formats enable designers to make trade-off decisions for both the package and the board and communicate those recommendations back to the other design team in formats that are native to their tools. Cadence's Xin Mu explains precoding ... » read more

Research Bits: July 18
By Jesse Allen - 18 Jul, 2023 - Comments: 0

Miniaturized ferroelectric FETs Researchers from the University of Pennsylvania, Hanyang University, King Abdulaziz University, King Abdullah University of Science and Technology, and University of Tokyo proposed a new ferroelectric FET (FE-FET) design with improved performance for both computing and memory. The transistor layers the two-dimensional semiconductor molybdenum disulfide (MoS2)... » read more

Research Bits: July 12
By Jesse Allen - 12 Jul, 2023 - Comments: 0

Predicting crystal orientation Researchers from Nagoya University and RIKEN trained an AI on optical photographs of polycrystalline silicon and used it to predict crystal orientation during manufacturing. They found that the AI successfully predicted the grain orientation distribution. “The time required for this measurement was about 1.5 hours for taking optical photographs, training the... » read more

Startup Funding: June 2023
By Jesse Allen - 10 Jul, 2023 - Comments: 0

June saw several large funding rounds, with seven of at least $100 million. Over half a billion dollars alone went to a Chinese company manufacturing silicon carbide (SiC) power semiconductors. The wide band gap material has seen steady interest from investors, particularly for its potential use in electric vehicles. Another of the month's mega-rounds went to a company designing RISC-V SoCs ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Jul, 2023 - Comments: 0

Worldwide semiconductor industry sales dropped 21% year-over-year in May to $40.7 billion, mostly driven by decreases in the Americas (-22%), Asia Pacific/All Other (-23%), and China (-29%). But there also were hints of a recovery. The three-month moving average showed a 1.7% increase in sales, with the largest increases in China (+3.9%) and Europe (+2%). “Despite continuing market sluggishne... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Jun, 2023 - Comments: 0

Keysight Technologies said it intends to acquire ESI Group for €913 million (~$998.6 million). ESI Group provides virtual prototyping solutions for the automotive and aerospace end markets that can create real-time digital twins to simulate a product's behavior during testing and real-life use. MLCommons announced the latest results from two MLPerf benchmark suites. One aims to measure the... » read more

Blog Review: June 28
By Jesse Allen - 28 Jun, 2023 - Comments: 0

In a podcast, Siemens' Spencer Acain discusses the role of AI and machine learning in IC verification and how it could help address noise by analyzing different signals from the diagnosis data to figure out the real root cause of a failure. Synopsys' Ian Land and Ron DiGiuseppe find that designers of aerospace microelectronics are applying lessons and technologies learned from the automotive... » read more

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