Blog Review: Jan. 24

3D-IC adoption challenges; logic signal conversion; auto predictions; microLEDs.


Siemens’ John McMillan finds that while 3D-IC capabilities are ready for mainstream, mass adoption success depends on how easily, effectively, and efficiently a solution can be delivered and points to five workflow adoption focus areas.

Cadence’s Andre Baguenie shows how to easily convert a logic signal to an electrical value using Verilog-AMS and the transition filter.

Synopsys’ Chris Clark, Ron DiGuiseppe, and Stewart Williams share their predictions for the automotive market, including market pressures driving shorter development cycles, centralized zonal architectures, and cybersecurity regulations.

Ansys’ Raha Vafaei finds that microLEDs are promising for a diverse range of applications from displays to high-speed light-based communication networks, particularly those that demand high brightness, high-resolution density, response time, and robustness in extreme conditions.

Arm’s Adnan AlSinan and Gian Marco Iodice check out how generative AI is taking the next step to mobile devices and why key techniques for running large language models such as integer quantization, thread affinity, and matrix-by-matrix and matrix-by-vector routines.

Keysight’s Emily Yan highlights some key aspects of IP management for chiplet-based designs, including standardization of IP tracking and verification mechanisms to ensure that the integrated IP blocks interact correctly and adhere to all design requirements and standards.

In a blog for SEMI, Teradyne’s Jeorge S. Hurtarte suggests that the strategic integration of data analytics, machine learning, and AI into semiconductor manufacturing has the potential to extend Moore’s Law, but will require industry collaboration and a move beyond silos.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Amkor’s JiHye Kwon shows a method for predicting the maximum allowable current density or lifetime in specific field conditions.

Lam Research’s Brett Lowe lays out how to increase the storage density of ReRAM by stacking memory cells vertically.

ASE’s Calvin Shiao, AshtonWS Huang, and Alfos Hsu explain how to optimize predictive maintenance, quality assurance, and process parameters.

Brewer Science’s Jessica Albright examines different ways to separate a thinned wafer from its temporary carrier substrate.

SEMI’s Ajit Manocha, Pushkar Apte, and Melissa Grupen-Shemansky look at deploying AI in the chip industry to create a virtuous cycle of innovation.

Synopsys’ Shela Aboud finds that the physics that govern the behavior of materials like GaN are much different than Si, necessitating new models.

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