Why packaging is becoming increasingly critical and difficult in the automotive market.

Most attacks in the past focused on gaining access to software, but Meltdown and Spectre have changed that forever.

Old problem is becoming more difficult to resolve at each new node; mitigation measures being developed.

Shortages of used equipment and lower margins mean this problem isn’t getting solved anytime soon.

5G is driving up demand for both 300mm and 200mm capacity. Both are in short supply.

As advanced-node chips are added into cars, and usage models shift inside of data centers, new questions surface about reliability.

Complicated and expensive technologies are being planned all the way to 2030, but it’s not clear how far the scaling roadmap will really go.

Why packaging is becoming increasingly critical and difficult in the automotive market.

The country is banking on DRAM and NAND to reduce its trade deficit.

Autonomous vehicles will cause fundamental shifts across a number of established industry segments tied to automotive, opening up big opportunities for chips and tools.

Flexible hybrid electronics are showing up in a variety of markets where electronics never existed before.

Total private funding was more than $1.35B in 2H 2017, but investors also are showing more caution about where they put their money.

The number of low-density packaging options is increasing as the popularity of advanced packaging grows.