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Week In Review: Design, Low Power


Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

Startup Funding: July 2023


Investors pumped more than $2.8 billion into 123 companies July. It was a particularly strong month for photonics companies, with a photonic integrated circuit foundry raising more than $100 million. Startups this month also are using photonic technology in innovative ways. This includes an all-optical RISC processor, biomarker identification, faster fully homomorphic encryption, and more AI... » read more

Blog Review: Aug. 2


Siemens' Katie Tormala points to the need for die attach thermal testing to ensure efficient removal of heat dissipation from power electronics components to prevent premature failure or thermal runaway. Synopsys's Dermott Lynch notes that over 30% of semiconductor failures are attributed to electrostatic discharge, with damage ranging from leakages and shorts to junction and metallization b... » read more

Blog Review: July 26


Siemens' Chris Spear shows how to make a group of specialized classes in SystemVerilog. Synopsys' Guy Cortez and Randy Fish consider what a silicon lifecycle management strategy looks like for SoCs deployed in HPC and data center environments. Cadence's Veena Parthan provides a primer on writing Python scripts for Fidelity, including API descriptions and different sets of packages to acce... » read more

Research Bits: July 24


Protons improve ferroelectric memory Researchers from King Abdullah University of Science and Technology (KAUST), Qingdao University, and Zhejiang University developed a method to produce multiple phase transitions in ferroelectric materials, which could increase storage capacity for neuromorphic memory. The approach uses proton-mediation of the ferroelectric material indium selenide. The r... » read more

Week In Review: Design, Low Power


Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

Blog Review: July 19


Siemens' Keith Felton argues that co-design-driven semiconductor package planning and prototyping is critical for design success and points to how interchange formats enable designers to make trade-off decisions for both the package and the board and communicate those recommendations back to the other design team in formats that are native to their tools. Cadence's Xin Mu explains precoding ... » read more

Research Bits: July 18


Miniaturized ferroelectric FETs Researchers from the University of Pennsylvania, Hanyang University, King Abdulaziz University, King Abdullah University of Science and Technology, and University of Tokyo proposed a new ferroelectric FET (FE-FET) design with improved performance for both computing and memory. The transistor layers the two-dimensional semiconductor molybdenum disulfide (MoS2)... » read more

Research Bits: July 12


Predicting crystal orientation Researchers from Nagoya University and RIKEN trained an AI on optical photographs of polycrystalline silicon and used it to predict crystal orientation during manufacturing. They found that the AI successfully predicted the grain orientation distribution. “The time required for this measurement was about 1.5 hours for taking optical photographs, training the... » read more

Startup Funding: June 2023


June saw several large funding rounds, with seven of at least $100 million. Over half a billion dollars alone went to a Chinese company manufacturing silicon carbide (SiC) power semiconductors. The wide band gap material has seen steady interest from investors, particularly for its potential use in electric vehicles. Another of the month's mega-rounds went to a company designing RISC-V SoCs ... » read more

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