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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Week In Review: Design, Low Power
By Jesse Allen - 01 Oct, 2021 - Comments: 0

Valens Semiconductor began trading on the New York Stock Exchange as VLN after a merger with special-purpose acquisition company (SPAC) PTK Acquisition Corp. Valens offers high-speed connectivity chips for the audio-video and automotive markets, including its HDBaseT technology for connectivity between ultra-HD video sources and remote displays and its in-vehicle high-speed links. The transacti... » read more

Blog Review: Sept. 29
By Jesse Allen - 29 Sep, 2021 - Comments: 0

Cadence's Paul McLellan checks out two of the biggest chips presented at the recent Hot Chips: a graphics chip from Intel for an upcoming supercomputer and Cerebras' wafer-scale AI chip. Synopsys' Datsen Davies Tharakan lists the top five design challenges for electric vehicles and power semiconductors and why a robust design flow can accelerate the growth of hybrid and electric vehicles goi... » read more

Power/Performance Bits: Sept. 28
By Jesse Allen - 28 Sep, 2021 - Comments: 0

Pneumatic memory Engineers at the University of California Riverside developed a pneumatic memory that can be used to control soft robots. Pneumatic soft robots use pressurized air to move soft, rubbery limbs and grippers, making them ideal for delicate tasks as well as safer to be around. However, they still require electronic valves and computers to control and maintain positions. The ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 Sep, 2021 - Comments: 0

U.S. government officials met with semiconductor industry companies and automakers to request supply chain information it hopes could address the current semiconductor shortage, Reuters reports. Secretary of Commerce Gina Raimondo hopes the information will enable them and industry to "get more granular into the bottlenecks and then ultimately predict challenges before they happen," but also wa... » read more

Blog Review: Sept. 22
By Jesse Allen - 22 Sep, 2021 - Comments: 0

Ansys' Tyler Ferris describes some of the many ways electronics on a PCB assembly can fail, from component level failures like wirebond breaking and liftoff to board-level failures such as conductive anodic filament failure. Cadence's Paul McLellan considers the switch from low-speed parallel interfaces to high-speed serial interfaces as one of the key advancements making modern data centers... » read more

Power/Performance Bits: Sept. 21
By Jesse Allen - 21 Sep, 2021 - Comments: 0

Catching switches in action Researchers from SLAC National Accelerator Laboratory, Stanford University, Hewlett Packard Labs, Penn State University, and Purdue University observed atoms moving inside an electronic switch as it turns on and off, revealing a state they suspect could lead to faster, more energy-efficient devices. "This research is a breakthrough in ultrafast technology and sci... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Sep, 2021 - Comments: 0

MoSys, a provider of SRAM solutions and networking accelerators, and Peraso Technologies, a provider of 5G mmWave devices, are merging. Stockholders of Peraso are expected to hold a 61% equity interest in the combined company, with the remaining 39% equity interest to be retained by the stockholders of MoSys. Peraso CEO Ronald Glibbery said, "By joining with MoSys, we believe we can deliver a b... » read more

Blog Review: Sept. 15
By Jesse Allen - 15 Sep, 2021 - Comments: 0

Synopsys' Ian Land and Ricardo Borges examine how radiation modeling can help ensure semiconductor components will survive while housed in equipment that is orbiting our planet or traveling through deep space over extensive periods of time. Siemens EDA's Rich Edelman explores why writing coverage is an art requiring imagination, practice, and patience, along with some tips on how to improve.... » read more

Power/Performance Bits: Sept. 14
By Jesse Allen - 14 Sep, 2021 - Comments: 0

Thermal management material Engineers at the University of California Los Angeles integrated a new thermal management material, boron arsenide, with a HEMT chip to demonstrate the material's potential. The team developed boron arsenide as a thermal management material in 2018 and found it to be very effective at drawing and dissipating heat. In the latest experiments, they used wide band... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Sep, 2021 - Comments: 0

Tools & IP Cadence and Samsung Foundry are offering Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm. Enabling access to mixed-signal designs in a common OpenAccess database, the co-design methodology promotes shared responsibilities and collaboration between the analog and digital teams ... » read more

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