Blog Review: Sept. 15

Radiation modeling; coverage as art; AR contact lenses; 3D-IC.


Synopsys’ Ian Land and Ricardo Borges examine how radiation modeling can help ensure semiconductor components will survive while housed in equipment that is orbiting our planet or traveling through deep space over extensive periods of time.

Siemens EDA’s Rich Edelman explores why writing coverage is an art requiring imagination, practice, and patience, along with some tips on how to improve.

Cadence’s Paul McLellan checks out a company adding an augmented reality display, sensors, and wireless communication to contact lenses.

In a blog for SEMI, Ansys’ John Lee argues that integrating a single system on an SoC is no longer ideal for many applications where 3D and 2.5D multi-die chip assemblies improves yield and optimization.

Coventor’s QingPeng Wang examines the impact of shallow trench isolation profile on device performance in a 5nm finFET vehicle and how virtual fabrication can help address profile variation issues.

Arm’s Hannes Tschofenig shares an API that enables IoT developers to transparently access security functionality residing on and off the chip.

Ansys’ Mark Christini explains how to model Litz wire often used in power conversion equipment to reduce induced alternating current losses in conductors and the challenges posed by the wire’s many insulated strands.

Memory blogger Jim Handy shares a video from Charlotte Streeter explaining the inner workings of one type of SiO-based ReRAM.

NXP’s Timo van Roermund checks out the new ISO/SAE 21434 standard for automotive cybersecurity, how it was developed, and the impact it is expected to have on support for legacy components.

Onsemi’s Radhika Arora points to why high resolution and high dynamic range are such important attributes for camera sensors used in ADAS and autonomous driving.

And don’t miss the blogs featured in the latest Low Power-High Performance newsletter:

Fraunhofer IIS EAS’ André Lange finds a growing need for aging models to ensure reliability.

Arm’s Fernando García Redondo, Pranay Prabhat, and Mudit Bhargava dig into the behavior of MRAM switching at significant statistical events.

Synopsys’ Priyank Shukla lays out how to accelerate the path to compliance and design closure for HPC SoCs.

Siemens EDA’s Derong Yan questions whether the shortest path is useful when debugging resistance.

Cadence’s Paul McLellan looks at the processors that will that power most of the upcoming laptops, servers, and gaming consoles.

Rambus’ Frank Ferro predicts we’re at the cusp of another generational change in HBM.

Ansys’ Marc Swinnen explains how speed and integration density are affecting semiconductors, PCBs, systems, and photonics.

Infineon’s Zhihui Yuan examines differences in the short-circuit behavior of SiC MOSFET and IGBT devices.

Synopsys’ Ramsay Allen looks to silicon lifecycle management to enable heightened levels of visibility in device performance, reliability, and security.

Synopsys’ Rahul Deokar considers how to optimize designs for high performance while meeting aggressive design schedules.

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