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MEMS: New Materials, Markets And Packaging


Semiconductor Engineering sat down to talk about future developments and challenges for microelectromechanical systems (MEMS) with Gerold Schropfer, director of MEMS products and European operations in Lam Research's Computational Products group, and Michelle Bourke, senior director of strategic marketing for Lam's Customer Support Business Group. What follows are excerpts of that conversation.... » read more

Blog Review: July 28


Synopsys' Chris Clark considers potential vulnerabilities in automotive over-the-air updates and best practices and new standards the industry can implement to improve security of vehicle software updates. Cadence's Paul McLellan gets a look at expected new fab construction in the coming years and where capacity is being focused. Siemens' Robin Bornoff dives into electromagnetic simulatio... » read more

The Effects Of Poly Corner Etch Residue On Advanced FinFET Device Performance


In this paper, we study the effect of poly corner residue during a 5nm FinFET poly etch process using virtual fabrication. A systemic investigation was performed to understand the impact of poly corner residue on hard failure modes and device performance. Our results indicate that larger width and height residues can lead to a hard failure by creating a short between the source/drain epitaxy an... » read more

Blog Review: June 30


Siemens EDA's Chris Spear considers what classes should represent in SystemVerilog and offers two major categories along with some helpful UVM tips. Cadence's Paul McLellan listens in on keynotes at the recent TSMC Technology Symposium, including TSMC CEO C. C. Wei's introduction some of the fab's new offerings, such as an automotive-focused N5 process. Synopsys' Dennis Kengo Oka notes th... » read more

Blog Review: June 23


Synopsys' Manuel Mota shows how splitting SoCs into smaller dies for advanced packaging and using die-to-die interfaces to enable high bandwidth, low latency, and low power connectivity can benefit hyperscale data centers. Siemens EDA's Chris Spear explains the relationship between classes and objects in SystemVerilog with a handy visualization and notes the difference between SystemVerilog ... » read more

Fan-Out Packaging Options Grow


Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

Using Virtual Process Libraries To Improve Semiconductor Manufacturing


People think that semiconductor process simulation libraries should be developed using a perfect theoretical background that is strongly supported by empirical data. This might be true in academic research, where researchers are trying to develop a systematic approach to understanding a process mechanism. However, it is definitely not true in production fabs, where engineers need to quickly a... » read more

Process Model Calibration: The Key To Building Predictive And Accurate 3D Process Models


The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new technology to the market quickly. In the initial stages of semiconductor technology development, innovative process flow schemes must be tested using silicon test wafers. These wafer tests are len... » read more

Blog Review: Jun 9


Arm's Partha Maji introduces a collaboration with the University of Cambridge to advance Bayesian statistics and probabilistic machine learning, which could play a vital role in safety-critical AI applications. Siemens' Thomas Dewey looks at a way to improve autonomous driving capabilities by enabling vehicles to train on past hazardous situations to provide and early warning for when they m... » read more

Principles, Applications, And The Future Of Piezoelectric MEMS


Piezoelectricity is a property of certain materials to become electrically polarized under strain and stress. This phenomenon has been studied extensively since it was first discovered in the mid-18th century. Piezoelectric materials can generate an electric charge in response to an applied mechanical stress and can also generate mechanical stress upon an applied electrical charge. These mater... » read more

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