Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

The Week In Review: Manufacturing
By Mark LaPedus - 13 Mar, 2015 - Comments: 0

Look out below! Intel has lowered its first-quarter revenue outlook. The company now expects first-quarter revenue to be $12.8 billion, plus or minus $300 million, compared to the previous expectation of $13.7 billion, plus or minus $500 million. “Intel may be experiencing greater-than-expected seasonal declines in both notebooks and desktops,” said Doug Freedman, an analyst with RBC Capita... » read more

Manufacturing Bits: March 10
By Mark LaPedus - 10 Mar, 2015 - Comments: 0

Hi-tech pens The University of California at San Diego has developed a hi-tech ballpoint pen. Researchers have taken off-the-shelf ballpoint pens and filled them with bio inks. With so-called enzymatic-ink-based roller pens, users are able to draw biocatalytic sensors on a surface. [caption id="attachment_18297" align="alignleft" width="300"] Researchers draw sensors capable of detecting... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Mar, 2015 - Comments: 0

EUV lithography remains a mixed bag, according to analysts. "We are downgrading shares of ASML to 'Sector Perform' from 'Outperform' as we think shares appear fully valued based on midterm lithography demand and our view that meaningful EUV adoption is still several years out," said Weston Twigg, an analyst with Pacific Crest Securities, in a new report. "We think the reality is that it is not ... » read more

More Lithography Options?
By Mark LaPedus - 03 Mar, 2015 - Comments: 1

Lithographers face some tough decisions at 10nm and beyond. At these nodes, IC makers are still weighing the various patterning options. And to make it even more difficult, lithographers could soon have some new, and potentially disruptive, options on the table. On one front, the traditional next-generation lithography (NGL) technologies are finally making some noticeable progress. For examp... » read more

Manufacturing Bits: March 3
By Mark LaPedus - 03 Mar, 2015 - Comments: 0

Nanoimprint consortium CEA-Leti has launched a nanoimprint lithography program in an effort to propel the technology in the marketplace. The imprint program, dubbed Inspire, will focus on various and emerging non-semiconductor applications, according to Laurent Pain, patterning program manager and business development manager within the Silicon Technologies division at the French R&D or... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Feb, 2015 - Comments: 0

At the SPIE Advanced Lithography conference in San Jose, Calif., there were several takeaways. First, the battle for lithography share is heating up at Intel. “We believe Nikon still holds a decent position at Intel, but with ASML gaining some share at 10nm. Nikon could regain some share with its new platform at 7nm, in our view, but it is early to tell. We believe Nikon has improved its posi... » read more

Manufacturing Bits: Feb. 24
By Mark LaPedus - 24 Feb, 2015 - Comments: 0

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Feb, 2015 - Comments: 0

For years, chipmakers have attempted to build fabs in India. So far, however, India has failed to set up modern fabs and for good reason. There are issues in terms of obtaining dependable power and water for a fab in India, according to Will Strauss, president of Forward Concepts, who added that India also suffers from government bureaucracy. India is still trying. Last week, Cricket Semicon... » read more

5 Disruptive Mask Technologies
By Mark LaPedus - 19 Feb, 2015 - Comments: 0

Photomask complexity and costs are increasing at each node, thereby creating a number of challenges on several fronts. On one front, for example, traditional single-beam e-beam tools are struggling to keep up with mask complexity. As a result, the write times and costs continue to rise. Mask complexity also impacts the other parts of the tool flow, such as inspection, metrology and repair. I... » read more

3D NAND Market Heats Up
By Mark LaPedus - 19 Feb, 2015 - Comments: 4

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were supposed to ship 3D NAND devices in volumes last year, but vendors pushed out their production dates for various business and technical reasons. Going into 2015, [getentity id="22865" e_nam... » read more

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