Author's Latest Posts


Speeding Up Mask Production


Chip production is becoming more complex and expensive at each node. As a result, chipmakers require a growing number of new manufacturing technologies to enable the next wave of devices at advanced nodes. In the fab, for example, the most obvious need is extreme ultraviolet ([gettech id="31045" comment="EUV"]) lithography. In addition, chipmakers also need a new class of atomic-level proces... » read more

The Week In Review: Manufacturing


Chipmakers GlobalFoundries has rolled out its next-generation FD-SOI technology. The new 12nm FD-SOI process is called 12FDX. It is designed for a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles. "Some applications require the unsurpassed performance of finFET transistors, but the vast majority of connected devices need high l... » read more

Manufacturing Bits: Sept. 6


DARPA ALD The University of Colorado at Boulder has developed an atomic layer deposition (ALD) technology that can be performed at room temperatures. The technology, dubbed electron-enhanced ALD (EE-ALD), has been developed as part of the Local Control of Materials Synthesis (LoCo) program at the U.S. Defense Advanced Research Projects Agency (DARPA). The LoCo program is developing tech... » read more

The Week In Review: Manufacturing


Chipmakers AMD has entered into a long-term amendment to its wafer supply agreement (WSA) with GlobalFoundries for the period from Jan. 1, 2016 to Dec. 31, 2020. Today, GlobalFoundries’ Fab 8 in Malta, N.Y. is playing a big role in providing leading-edge foundry capacity for AMD's graphics and processor products. As part of the amended deal, AMD will grant to West Coast Hitech, a subsidia... » read more

Manufacturing Bits: Aug. 30


Redefining the ampere In 2014, an international group called the BIPM agreed to redefine four common units of measurements--the kilogram, the ampere, the kelvin and the mole. These units of measurement make up the so-called International System of Units or SI. In total, there are seven SI base units—meter, kilogram, second, ampere, kelvin, mole, and the candela. Work is already under wa... » read more

Deeper Inside Intel


Mark Bohr, senior fellow and director of process architecture and integration at Intel, and Zane Ball, vice president in the Technology and Manufacturing Group at Intel and co-general manager of Intel Custom Foundry, sat down with Semiconductor Engineering to discuss the future directions of transistors, process technology, the foundry business and packaging. What follows are excerpts of those ... » read more

The Week In Review: Manufacturing


Fab tool and material vendors Applied Materials reported its results for the third quarter ended July 31. Net sales of $2.82 billion were up 15% sequentially and up 13% year over year. "AMAT reported impressive upside in July quarter and guided October quarter well ahead of expectations as the company is seeing sizable tailwinds across: 1) WFE uptick driven by foundry and NAND orders; 2) stron... » read more

Trade War Looms Over Materials


It’s time to pay close attention to rare earths and raw materials--again. In fact, the supply chain teams and commodity buyers at aerospace, automotive and electronics companies may have some new and potentially big problems on their hands. For some time, the European Union (EU), the United States and other nations have been at odds with China over rare earths. China, which accounts for... » read more

How Small Will Transistors Go?


By Mark LaPedus & Ed Sperling There is nearly universal agreement that Moore’s Law is slowing down. But whether it will truly end, or just become too expensive and less relevant—and what will supplant device scaling—are the subject of some far-reaching research and much discussion. Semiconductor Engineering sat down with each of the leaders of three top research houses—[getent... » read more

Mask Maker Worries Grow


Leading-edge photomask makers face a multitude of challenges as they migrate from the 14nm node and beyond. Mask making is becoming more challenging and expensive at each node on at least two fronts. On one front, mask makers must continue to invest in the development of traditional optical masks at advanced nodes. On another front, several photomask vendors are preparing for the possible ra... » read more

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