Author's Latest Posts

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)
By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

Fano Resonance in a Si PIC Using a Piezoelectrically Driven Mechanism (Ghent, imec)
By Technical Paper Link - 06 Sep, 2024 - Comments: 0

A new technical paper titled "Piezoelectrically driven Fano resonance in silicon photonics" was published by researchers at Ghent University and imec. Abstract "Piezoelectric optomechanical platforms provide a promising avenue for efficient signal transduction between microwave and optical domains. Lead zirconate titanate (PZT) thin film stands out as a compelling choice for building such... » read more

New Strategies For Enhancing Transport Properties of Conducting Polymers (Cambridge, et al.)
By Technical Paper Link - 06 Sep, 2024 - Comments: 0

A new technical paper titled "Non-equilibrium transport in polymer mixed ionic–electronic conductors at ultrahigh charge densities" was published by researchers at Cambridge University, Grenoble Alpes University, CNRS, Humboldt-Universität zu Berlin, et al. Abstract "Conducting polymers are mixed ionic–electronic conductors that are emerging candidates for neuromorphic computing, bioel... » read more

Microfluidic Cooling Design For Hotspots in Thermal Design Power Chips (Corintis)
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization" was published by researchers at Corintis. Abstract: "The continuous increase in computational power of GPUs, essential for advancements in areas like artificial intelligence and data processing, is driving the adoption of liquid cooling in data centers. Skived copper... » read more

Scalable Chiplet System for LLM Training, Finetuning and Reduced DRAM Accesses (Tsinghua University)
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Hecaton: Training and Finetuning Large Language Models with Scalable Chiplet Systems" was published by researchers at Tsinghua University. Abstract "Large Language Models (LLMs) have achieved remarkable success in various fields, but their training and finetuning require massive computation and memory, necessitating parallelism which introduces heavy communicat... » read more

ECTC 2024 Session Readout: Advancement of Metrology
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

Cooling Technology For Next Gen Power Electronics
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Advances in Two-Phase Cooling for Next Power Electronics Converters" was published by researchers at ROMA TRE University, ENEA Casaccia Research Center and Sapienza University. "The proposed arrangement allows a greater extraction of the heat at a very low flow rate of the cooling fluid, even with standard industrial-grade heat-sinks, which motivates the use of ... » read more

Large-Scale VFETs With Ultra-Short Channel Length And High Performance
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Large-scale sub-5-nm vertical transistors by van der Waals integration" was published by researchers at Hunan University. "Here, we demonstrate a layer-by-layer transfer process of large-scale indium gallium zinc oxide (IGZO) semiconductor arrays and metal electrodes, and realize large-scale VFETs with ultra-short channel length and high device performance," sta... » read more

Hardware Security: One-Key Premise of Logic Locking
By Technical Paper Link - 30 Aug, 2024 - Comments: 0

A new technical paper titled "Late Breaking Results: On the One-Key Premise of Logic Locking" was published by researchers at Synopsys. Abstract "The evaluation of logic locking methods has long been predicated on an implicit assumption that only the correct key can unveil the true functionality of a protected circuit. Consequently, a locking technique is deemed secure if it resists a good ... » read more

Analysis of the Errors of High-Fidelity Two-Qubit Gates in Silicon Quantum Dots (UNSW et al.)
By Technical Paper Link - 28 Aug, 2024 - Comments: 0

A new technical paper titled "Assessment of the errors of high-fidelity two-qubit gates in silicon quantum dots" was published by researchers at UNSW, Diraq, Sandia National Laboratories, Keio University, Leibniz-Institut für Kristallzüchtung and others. Abstract "Achieving high-fidelity entangling operations between qubits consistently is essential for the performance of multi-qubit syst... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy