Author's Latest Posts

Leveraging Large Language Models (LLMs) To Perform SW-HW Co-Design
By Technical Paper Link - 28 Jun, 2023 - Comments: 0

A technical paper titled “On the Viability of using LLMs for SW/HW Co-Design: An Example in Designing CiM DNN Accelerators” was published by researchers at University of Notre Dame. Abstract: "Deep Neural Networks (DNNs) have demonstrated impressive performance across a wide range of tasks. However, deploying DNNs on edge devices poses significant challenges due to stringent power and com... » read more

Demonstrating The Utility Of Quantum Computing In A Pre-Fault-Tolerant Era
By Technical Paper Link - 28 Jun, 2023 - Comments: 0

A technical paper titled “Evidence for the utility of quantum computing before fault tolerance” was published by researchers at IBM Quantum, University of California Berkeley, RIKEN, and Lawrence Berkeley National Laboratory. Abstract: "Quantum computing promises to offer substantial speed-ups over its classical counterpart for certain problems. However, the greatest impediment to realizi... » read more

Leveraging Quantum Light Within Deployable Quantum Sensors
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “Integrated quantum optical phase sensor in thin film lithium niobate” was published by researchers at Stanford University and NTT Research. Abstract: "The quantum noise of light, attributed to the random arrival time of photons from a coherent light source, fundamentally limits optical phase sensors. An engineered source of squeezed states suppresses this noise a... » read more

Design of Selective Deposition Processes For Nanoscale Electronic Devices
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “Quantified Uniformity and Selectivity of TiO2 Films in 45-nm Half Pitch Patterns Using Area-Selective Deposition Supercycles” was published by researchers at IMEC, North Carolina State University, and KU Leuven. Abstract: "Area-selective deposition (ASD) shows great promise for sub-10 nm manufacturing in nanoelectronics, but significant challenges remain in scali... » read more

Engineering Miniaturized And Low Operating Voltage Neuromorphic Platforms Across The Light Spectrum 
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “Long Duration Persistent Photocurrent in 3 nm Thin Doped Indium Oxide for Integrated Light Sensing and In-Sensor Neuromorphic Computation” was published by researchers at RMIT University and Deakin University (Australia). Abstract: "Miniaturization and energy consumption by computational systems remain major challenges to address. Optoelectronics based synap... » read more

Demonstrating A Fully-2D-Material Based Device For Temperature Sensing In Cryogenic Regimes
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “I-V-T Characteristics and Temperature Sensor Performance of a Fully-2D WSe2/MoS2 Heterojunction Diode at Cryogenic Temperatures” was published by researchers at Technische Universität Dresden, Institute of Ion Beam Physics and Materials Research, and National Institute for Materials Science. Abstract: "In this work, we demonstrate the usability of a fully-2D-mat... » read more

Addressing The Challenge Of Metallization In Highly Integrated (3D) Stretchable Electronics
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “Scalable electrodeposition of liquid metal from an acetonitrile-based electrolyte for highly-integrated stretchable electronics” was published by researchers at KU Leuven. Abstract: "For the advancement of highly-integrated stretchable electronics, the development of scalable sub-micrometer conductor patterning is required. Eutectic gallium indium EGaIn is an att... » read more

The Implementation Of Cooperative Collision Avoidance For Connected Vehicles (Ohio State University)
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Cooperative Collision Avoidance in a Connected Vehicle Environment” was published by researchers at Ohio State University. Abstract: "Connected vehicle (CV) technology is among the most heavily researched areas in both the academia and industry. The vehicle to vehicle (V2V), vehicle to infrastructure (V2I) and vehicle to pedestrian (V2P) communication capabilitie... » read more

Fault Awareness And Reliability Improvements In a Fault-Tolerant RISC-V SoC (HARV-SoC)
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Enhancing Fault Awareness and Reliability of a Fault-Tolerant RISC-V System-on-Chip” was published by researchers at University of Montpellier and University of Vale do Itajaí. Abstract: "Recent research has shown interest in adopting the RISC-V processors for high-reliability electronics, such as aerospace applications. The openness of this architecture enables... » read more

Search Based Method For Identifying Aging Model Parameters
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Leveraging Public Information to Fit a Compact Hot Carrier Injection Model to a Target Technology” was published by researchers at University of Victoria. Abstract: "The design of countermeasures against integrated circuit counterfeit recycling requires the ability to simulate aging in CMOS devices. Electronic design automation tools commonly provide this ability... » read more

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