Author's Latest Posts


Designing Hardware Accelerators Using A Data-Driven Approach


Research paper titled "Data-Driven Offline Optimization For Architecting Hardware Accelerators" by researchers at Google Research and UC Berkeley. Abstract "Industry has gradually moved towards application-specific hardware accelerators in order to attain higher efficiency. While such a paradigm shift is already starting to show promising results, designers need to spend considerable man... » read more

Novel Family of Semiconductors


New research paper titled "Semiconducting silicon–phosphorus frameworks for caging exotic polycations" from researchers at Department of Chemistry, Iowa State University, and Ames Laboratory, U.S. Department of Energy. Abstract "A series of novel semiconductors AAe6Si12P20X (A = Na, K, Rb, Cs; Ae = Sr, Ba; X = Cl, Br, I) is reported. Their crystal structures feature a tetrahedral Si–P f... » read more

OTA On-Chip Computing That Conquers A Bottleneck In Wired NoC Architectures


New research paper titled "Wireless On-Chip Communications for Scalable In-memory Hyperdimensional Computing" from researchers at IBM Research, Zurich Switzerland and Universitat Politecnica de Catalunya, Barcelona, Spain Abstract: "Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using very long random vectors (aka hyp... » read more

National Highway Traffic Safety Administration Reports on Levels 2-5


The National Highway Traffic Safety Administration (NHTSA) released data on crashes for ADAS and ADS systems, as reported by automakers and operators. Data was collected for the time period July 2021-May 2022. Find the SAE Level 2 advanced driver assistance systems (ADAS) summary report here and the SAE Levels 3-5 automated driving systems (ADS) summary report here. Report was published in J... » read more

Designing and Simulating Low-Voltage CMOS Circuits Using Four-Parameter Model


New technical paper titled "Bridging the Gap between Design and Simulation of Low-Voltage CMOS Circuits" from researchers at Federal University of Santa Catarina, Brazil. Abstract "This work proposes a truly compact MOSFET model that contains only four parameters to assist an integrated circuits (IC) designer in a design by hand. The four-parameter model (4PM) is based on the advanced com... » read more

Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices


New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Hardware Dynamic IFT Mechanism That Scales to Complex Open-Source RISC-V Processors


New technical paper titled "CellIFT: Leveraging Cells for Scalable and Precise Dynamic Information Flow Tracking in Hardware Designs" by researchers at ETH Zurich and Intel.  Paper to be presented at USENIX Security 2022 (August 10-12, 2022) in Boston, MA, USA. Partial Abstract "We introduce CELLIFT, a new design point in the space of dynamic IFT [Information flow tracking] for hardware. C... » read more

Flexible Microprocessors (FlexiCores)- Natively flexible 4-bit and 8-bit microprocessors optimized for low footprint and yield


New research paper titled "FlexiCores: low footprint, high yield, field reprogrammable flexible microprocessors" from researchers at University of Illinois and PragmatIC Semiconductor. Abstract "Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requir... » read more

Graphene Nanoribbon Transistors Using Hydrocarbon Seeds (University of Wisconsin-Madison)


New research paper titled "Graphene nanoribbons initiated from molecularly derived seeds" from researchers at University of Wisconsin-Madison with contributions from Argonne National Laboratory. Abstract "Semiconducting graphene nanoribbons are promising materials for nanoelectronics but are held back by synthesis challenges. Here we report that molecular-scale carbon seeds can be exploi... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration


New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

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