Cost Characteristics of the 2.5D Chiplet-Based SiP System


A technical paper titled “Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies” was published by researchers at UCSB, University of California, Santa Barbara.

“The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is critical when making a design decision. In this paper, we develop an analytical cost model that can estimate the cost of the 2.5D chiplet-based SiP systems under various interconnection options and technology nodes. We conducted two case studies using our cost model to explore the cost characteristics of the 2.5D chiplet-based SiP system. Based on the case studies, we made several observations on the interposer selection, design partition granularity, and technology node adoption for cost-efficient chiplet-based SiP design.”

Find the technical paper here. Published June 2022.

arXiv:2206.07308v1. Authors: Tianqi Tang, Yuan Xie.

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