HBM3 In The Data Center

What the new version of high-bandwidth memory will bring, and where the challenges are.


Frank Ferro, senior director of product management at Rambus, talks about the forthcoming HBM3 standard, why this is so essential for AI chips and where the bottlenecks are today, what kinds of challenges are involved in working with this memory, and what impact chiplets and near-memory compute will have on HBM and bandwidth.



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