Die-To-Die Connectivity


Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as high-performance computing, AI SoCs, optical modules, and where the tradeoffs are for different applications.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTu... » read more

GDDR6 Drilldown: Applications, Tradeoffs And Specs


Frank Ferro, senior director of product marketing for IP cores at Rambus, drills down on tradeoffs in choosing different DRAM versions, where GDDR6 fits into designs versus other types of DRAM, and how different memories are used in different vertical markets. » read more

GDDR6 Pushes The Memory Envelope For AI And ADAS


Memory bandwidth is an ever-increasing critical bottleneck for a wide range of use cases and applications. These include artificial intelligence (AI), machine learning (ML), advanced driver-assistance systems (ADAS), as well as 5G wireless and wireline infrastructure. In addition to memory bottlenecks, the above-mentioned use cases and applications are rapidly hitting the real-world limits of t... » read more

Tricky Tradeoffs For LPDDR5


LPDDR5 is slated as the next-gen memory for AI technology, autonomous driving, 5G networks, advanced displays, and leading-edge camera applications, and it is expected to compete with GDDR6 for these applications. But like all next-gen applications, balancing power, performance, and area concerns against new technology options is not straightforward. These are interesting times in the memory... » read more

Memory Options And Tradeoffs


Steven Woo, Rambus fellow and distinguished inventor, talks with Semiconductor Engineering about different memory options, why some are better than others for certain tasks, and what the tradeoffs are between the different memory types and architectures.     Related Articles/Videos Memory Tradeoffs Intensify In AI, Automotive Applications Why choosing memories and archi... » read more

5G Design Changes


Mike Fitton, senior director of strategic planning at Achronix, talks with Semiconductor Engineering about the two distinct parts of 5G deployment, how to get a huge amount of data from the core to the edge of a device where it is usable, and how a network on chip can improve the flow of data. » read more

Inferencing At The Edge


Geoff Tate, CEO of Flex Logix, talks about the challenges of power and performance at the edge, why this market is so important from a business and technology standpoint, and what factors need to be balanced. » read more

Latency Under Load: HBM2 vs. GDDR6


Steven Woo, Rambus fellow and distinguished inventor, explains why data traffic and bandwidth are critical to choosing the type of DRAM, options for improving traffic flow in different memory types, and how this works with multiple memory types.   Related Video GDDR6 - HBM2 Tradeoffs Why designers choose one memory type over another. Applications for each were clearly delineate... » read more

The Promise Of GDDR6 And 7nm


Research Nester, a market research and consulting firm, estimates that the “global market of computer graphics may witness a remarkable growth and reach at the valuation of $215.5 billion by the end of year 2024.” Plus, it says this market is expected to grow at a significant compound annual growth rate or CAGR of 6.1% over the forecast period 2017 to 2024. Computer graphics is just the ... » read more

3 Big Challenges For 5G


The general assumption is that we will all be walking around with 5G phones in our pockets someday, but 5G devices may look more like a home router, a car, or maybe even a tablet than a smart phone. There are three main problems that need to be solved here. The big one is coverage, and that gets confusing because it depends on which version of 5G people are talking about. There are at least ... » read more

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