Memory Test Challenges, Opportunities


The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

Targeting And Tailoring eFPGAs


Robert Blake, president and CEO of Achronix, sat down with Semiconductor Engineering to discuss what's changing in the embedded FPGA world, why new levels of customization are so important, and difficulty levels for implementing embedded programmability. What follows are excerpts of that discussion. SE: There are numerous ways you can go about creating a chip these days, but many of the prot... » read more

CCIX – What And Why?


There are two significant issues with today’s I/O interconnects: high speed storage and networking applications need more bandwidth than currently available technologies provide, and co-processing/acceleration functions need cache coherency for faster access to memory in heterogeneous multi-processor systems. These requirements are driving the development of a new specification called Cache C... » read more

The Week In Review: IoT


Deals Advanced Semiconductor Engineering was selected by zGlue as its strategic manufacturing partner. The ASE Group will make the zGlue Integrated Platform, which is said to enable customization for consumer and industrial IoT markets. The ZiP integrates hardware and software in a modular 3DIC-based platform. ASE will assemble zGlue-certified chiplets for connecting through zGlue Smart Fabric... » read more

A Tale of Two Testers


David Tacelli, president and CEO of Xcerra, was excited. His company’s reception for customers (and the press) at the Trou Normand restaurant in San Francisco’s hip South of Market neighborhood was going very well. Gourmet salames and other tasty foods were on offer, along with fine wines and craft ales and beers. He gleefully pointed out to editors that the product to be introduced at t... » read more

CCIX Enables Machine Learning


It takes a lot of technology to enable something like machine learning, and not all of it is as glamorous as neural network architectures and algorithms. Several levels below that is the actual hardware on which these run, and that brings us into the even less sexy world of interfaces. One such interface, the Cache Coherent Interconnect for Accelerators (CCIX), pronounced C6, aims to make th... » read more

Come Together Right Now Over… Virtual Prototypes


As a frequent traveler and gadgets enthusiast I love the concept of all my devices being connected. However, more often than not I experience a divide which is sometimes caused by bad software and sometimes caused by missing hardware interfaces. My recent frustration was related to my tablet missing a USB port to upload new maps to my GPS device. The GPS device became a divided, isolated pi... » read more

Building One Interface Subsystem For Multiple IoT SoCs


When designing SoCs for Internet of Things (IoT) applications, designers quickly realize that their most efficient use of resources will result in chips that can address multiple end applications. Consumer products require connectivity or edge devices, and networking or enterprise companies are broadening their reach to home networking and cloud services, like remote processing, that complement... » read more

Cloud Computing Chips Changing


An explosion in cloud services is making chip design for the server market more challenging, more diverse, and much more competitive. Unlike datacenter number crunching of the past, the cloud addresses a broad range of applications and data types. So while a server chip architecture may work well for one application, it may not be the optimal choice for another. And the more those tasks beco... » read more

Supporting CPUs Plus FPGAs


While it has been possible to pair a CPU and FPGA for quite some time, two things have changed recently. First, the industry has reduced the latency of the connection between them and second, we now appear to have the killer app for this combination. Semiconductor Engineering sat down to discuss these changes and the state of the tool chain to support this combination, with Kent Orthner, system... » read more

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