tag: HBM

Machine Learning Shifts More Work to FPGAs, SoCs
By Kevin Fogarty - 24 Sep, 2018 - Comments: 0

A wave of machine-learning-optimized chips is expected to begin shipping in the next few months, but it will take time before data centers decide whether these new accelerators are worth adopting and whether they actually live up to claims of big gains in performance. There are numerous reports that silicon custom-designed for machine learning will deliver 100X the performance of current opt... » read more

Processing In Memory
By Ed Sperling - 05 Sep, 2018 - Comments: 1

Adding processing directly into memory is getting a serious look, particularly for applications where the volume of data is so large that moving it back and forth between various memories and processors requires too much energy and time. The idea of inserting processors into memory has cropped up intermittently over the past decade as a possible future direction, but it was dismissed as an e... » read more

AI Architectures Must Change
By Brian Bailey - 13 Aug, 2018 - Comments: 3

Using existing architectures for solving machine learning and artificial intelligence problems is becoming impractical. The total energy consumed by AI is rising significantly, and CPUs and GPUs increasingly are looking like the wrong tools for the job. Several roundtables have concluded the best opportunity for significant change happens when there is no legacy IP. Most designs have evolved... » read more

Defining Edge Memory Requirements
By Ann Steffora Mutschler - 20 Jun, 2018 - Comments: 0

Defining edge computing memory requirements is a growing problem for chipmakers vying for a piece of this market, because it varies by platform, by application, and even by use case. Edge computing plays a role in artificial intelligence, automotive, IoT, data centers, as well as wearables, and each has significantly different memory requirements. So it's important to have memory requirement... » read more

Measuring And Analyzing SoC Performance With Verdi Performance Analyzer
By Synopsys - 23 May, 2018 - Comments: 0

SoC performance is a key competitive advantage in the marketplace. The choice and configuration of SoC components—protocol IP and interconnects, is geared towards maximizing overall SoC performance. A case in point is the use of HBM (High Bandwidth Memory) technology and controllers. Currently in its third generation, HBM boasts high-performance while using less power in a substantially small... » read more

Tech Talk: HBM vs. GDDR6
By Ed Sperling - 10 May, 2018 - Comments: 0

Frank Ferro, senior director of product management at Rambus, talks about memory bottlenecks and why both GDDR6 and high-bandwidth memory are gaining steam and for which markets. https://youtu.be/CPqdZZooS2g » read more

Challenges At The Edge
By Kevin Fogarty - 03 May, 2018 - Comments: 0

By Kevin Fogarty and Ed Sperling Edge computing is inching toward the mainstream as the tech industry begins grappling with the fact that far too much data will be generated by sensors to send everything back to the cloud for processing. The initial idea behind the IoT/IIoT, as well as other connected devices, was that simple sensors would relay raw data to the cloud for processing throug... » read more

Architecture, Materials And Software
By Ed Sperling - 12 Apr, 2018 - Comments: 0

AI, machine learning and autonomous vehicles will require massive improvements in performance, at the same power consumption level (or better), over today's chips. But it's obvious that the usual approach of shrinking features to improve power/performance isn't going to be sufficient. Scaling will certainly help, particularly on the logic side. More transistors are needed to process a huge i... » read more

How AI Impacts Memory Systems
By Steven Woo - 08 Mar, 2018 - Comments: 0

Throughout the 1980’s and early 1990’s computer systems were bottlenecked by relatively slow CPU performance, thereby limiting what applications could do. Driven by Moore’s Law, transistor counts increased significantly over the years, improving system performance and enabling exciting new computing possibilities. Although computing capabilities have advanced significantly in recen... » read more

Toward High-End Fan-Outs
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

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