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It’s Official: HBM3 Dons The Crown Of Bandwidth King


With the publishing of the HBM3 update to the High Bandwidth Memory (HBM) standard, a new king of bandwidth is crowned. The torrid performance demands of advanced workloads, with AI/ML training leading the pack, drive the need for ever faster delivery of bits. Memory bandwidth is a critical enabler of computing performance, thus the need for the accelerated evolution of the standard with HBM3 r... » read more

Future Challenges For Advanced Packaging


Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

Setting Ground Rules For 3D-IC Designs


Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Reliability Concerns Shift Left Into Chip Design


Demand for lower defect rates and higher yields is increasing, in part because chips are now being used for safety- and mission-critical applications, and in part because it's a way of offsetting rising design and manufacturing costs. What's changed is the new emphasis on solving these problems in the initial design. In the past, defectivity and yield were considered problems for the fab. Re... » read more

Advanced Packaging For Automotive Chips


Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Missing Interposer Abstractions And Standards


The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, it will be a technique that only large companies can deploy because they need to treat everything almost as if it were a single die. The construction of large systems uses techniques, such as ab... » read more

A New Multi-Stimuli-Based Simulation Method for ESD Design Verification


Abstract: "This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD simulation using either HBM waveforms or TLP pulse trains, alone, is insufficient. We introduce a new mixed-mode simulation flow using combined HBM and TLP stimuli to achieve ESD design pr... » read more

HBM2E Raises The Bar For Memory Bandwidth


AI/ML training capabilities are growing at a rate of 10X per year driving rapid improvements in every aspect of computing hardware and software. HBM2E memory is the ideal solution for the high bandwidth requirements of AI/ML training, but entails additional design considerations given its 2.5D architecture. Designers can realize the full benefits of HBM2E memory with the silicon-proven memory s... » read more

Architecting Interposers


An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

HBM3 Memory: Break Through To Greater Bandwidth


AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new hei... » read more

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