How Multiphysics Simulation Enables 3D-IC Implementation At The Speed Of Light

Electronic designers need greater integration densities and faster data transfer rates to meet the increased performance requirements of technologies like 5G/6G, autonomous driving, and artificial intelligence. The semiconductor industry is shifting toward 3D-IC design to keep up with the ever-growing demand for high-performance and power-efficient devices that has outpaced the capabilities o... » read more

3D Heterogenous Integration: Design And Verification Challenges

Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across multiple physics, co-simulation and co-analysis of these phenomena are critical for a robust chip-package-system design. Advanced 2.5D/3D-IC systems are constructed with multiple dice, interposers, packa... » read more

Cost Characteristics of the 2.5D Chiplet-Based SiP System

A technical paper titled "Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies" was published by researchers at UCSB, University of California, Santa Barbara. Abstract: "The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to ... » read more