Author's Latest Posts


Analysis Of Random Resistive Faults And ATPG Effectiveness At RTL


The use of register transfer level (RTL) descriptions for design is now commonplace throughout the electronics industry. The wide range of flexibility in both Verilog and VHDL has provided incredible freedom so that the same function may be approached from many different directions. The resulting RTL may meet the functional requirements but fail to meet various other requirements such as optimi... » read more

DDR White Paper


DDR DRAM memory controllers have many competing demands on them. A good memory controller must improve the bandwidth of the memory interface while respecting the latency demands of the CPU, graphics, and real-time DRAM in the system while maintaining compliance with memory bus and on-chip bus standards. The read reorder buffer (RRB) is a silicon-proven architectural enhancement available in... » read more

DDR White Paper


DDR DRAM memory controllers have many competing demands on them. A good memory controller must improve the bandwidth of the memory interface while respecting the latency demands of the CPU, graphics, and real-time DRAM in the system while maintaining compliance with memory bus and on-chip bus standards. The read reorder buffer (RRB) is a silicon-proven architectural enhancement available in... » read more

Case Study: Microsemi Memory Interface


Microsemi qualified a structured approach to mixed-signal SoC verification using Questa ADMS, systematic pre-planning, and the OVM. To view this white paper, click here. » read more

DDR White Paper


DDR DRAM memory controllers have many competing demands on them. A good memory controller must improve the bandwidth of the memory interface while respecting the latency demands of the CPU, graphics, and real-time DRAM in the system while maintaining compliance with memory bus and on-chip bus standards. The read reorder buffer (RRB) is a silicon-proven architectural enhancement available in... » read more

A Study Of Model-Based Etch Bias Retarget For OPC


Model-based optical proximity correction is usually used to compensate for the pattern distortion during the microlithography process. Currently, almost all the lithography effects, such as the proximity effects from the limited NA, the 3D mask effects due to the shrinking critical dimension, the photo resist effects, and some other well known physical process, can all be well considered into m... » read more

Over 65% Smartphone RF Switches SOI, Says Yole; Power Amps Next


By Adele Hars The industry research firm Yole Développement says that more than 65 percent of substrates used in fabricating switches for handsets are SOI-based. This is a high-growth part of the market, putting up double-digit increases. Like a standard SOI wafer, an RF SOI substrate has an active (“top”) layer on which CMOS transistors are built, with an isolating (“BOx”) ... » read more

SoC Power Integrity And Sign-Off For 28nm Designs


A presentation discussing how RedHawk enables physical design weakness identification, automatic repair the source of the supply noise, analyze impact of dynamic voltage drop on timing and jitter, verify power and signal EM, and provide a model of the chip’s PDN for system-level analysis. To view this video tutorial, click here. » read more

Avoiding Pitfalls While Specifying Timing Exceptions


Timing exceptions are commonly used to meet timing goals while implementing a design. These exceptions typically cover asynchronous paths like clock domain crossings (CDC) or synchronous paths where timing is either not relevant (e.g., set_false_path command in SDC) or can be relaxed (e.g., set_multicycle_path command in SDC), instructing static timing analysis (STA) and implementation tools to... » read more

User Defined Fault Models


This white paper describes the functionality of user defined fault models (UDFM), including gate exhaustive UDFM and cell-aware UDFM, and the effectiveness of lowering DPM in devices. To achieve today's quality and defect-per-million (DPM) goals, high-quality testing must achieve very high defect coverage. Testing today typically consists of generating test patterns based on multiple fault m... » read more

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