Author's Latest Posts

ST-Ericsson NovaThor This Year, 28nm FDSOI, Soitec Wafers
By Various Writers - 14 Mar, 2012 - Comments: 0

Big and official FD-SOI news: Soitec has announced that the company is supplying the FD-SOI wafers for ST-Ericsson’s next-generation of NovaThor 8540 smartphone/tablet processors. Starting at the 28nm node, this marks the industry’s first industrialization of the new planar, fully-depleted technology on ultra-thin SOI wafers. Soitec has just issued an official press release, but ST-Eri... » read more

FD-SOI Workshop ppts – STM’s 1st 28nm FD-SOI product line
By Various Writers - 12 Mar, 2012 - Comments: 0

The SOI Consortium’s 6th FD-SOI workshop, held just after ISSCC, yielded some exciting news. Most of the presentations are freely available for downloading from the SOI Consortium website. Here are the highlights. STMicroelectronics In a terrific presentation by Giorgio Cesana, Marketing Director at STMicroelectronics, he revealed that the company would be releasing a major product line b... » read more

FD-SOI – Recent Consortium Results (Part 1 of 3): Manufacturing
By Various Writers - 05 Mar, 2012 - Comments: 0

The most recent SOI Consortium benchmarking study regarding 28nm and 20nm FD-SOI results (silicon-calibrated simulations at the 28nm node of complex circuits including ARM cores and DDR3 memory controllers) covered a lot of ground. This post is part 1 of a 3-part blog series that will be highlighting key points with respect to: 1. manufacturing; 2. power & performance; 3. 20nm benchmarking ... » read more

Electronic Power And Thermal Management
By Various Writers - 09 Feb, 2012 - Comments: 0

Highly complex systems require integrating a large number of electrical components within a very limited space. This creates challenges for power and thermal management not seen in previous generations of electronic systems. To be successful, plans must incorporate advanced power and thermal management strategies from the earliest stages of the design process and assess power and thermal issues... » read more

32nm SOI is GloFo Fab 8′s 1st Silicon
By Various Writers - 18 Jan, 2012 - Comments: 0

Excellent news for the fast-growing SOI community:  the first chips produced at GlobalFoundries’ “Fab 8″ in upstate New York are based on IBM’s latest, 32nm SOI chip technology. In a joint press release, the two companies announced that the chips will be used by customers in networking, gaming and graphics. While the new chips began initial production at IBM’s 300mm fab in East... » read more

FD-SOI bests FinFETs for mobile multimedia SOCs? ST says yes.
By Various Writers - 29 Nov, 2011 - Comments: 0

In a recent and excellent article in ASN by Thomas Skotnicki, Director of the Advanced Devices Program at STMicro, he explains in a very clear and accessible way why FD-SOI with ultra-thin Body & Box (UTBB) is a better solution for mobile, multimedia SOCs than FinFETs -- starting at the 28nm node and running clearly through 8nm.  It is based on the paper he presented at the 2011 IEEE SOI C... » read more

ARM: Bulk ports directly to FD-SOI
By Various Writers - 17 Nov, 2011 - Comments: 0

In a recent ASN posting, ARM Fellow Jean-Luc Pelloie said that bulk logic designs can be ported directly to fully-depleted (FD)-SOI for high-performing, low-power mobile apps. ARM sees fully-depleted FD-SOI is a potential alternative to BULK 20nm.  Jean-Luc addressed the question of  what sort of impact a port from bulk FD-SOI would  have on the design flow. His answer is: very little. ... » read more

CMP, ST et al offer 28nm FD-SOI for prototyping, research
By Various Writers - 06 Nov, 2011 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ What would a port to 28nm FD-SOI do for your design?  A recent announcement by CMP, STMicroelectronics and Soitec invites you to find out.  Specifically, ST’s CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process – which uses innovative silicon substrates from Soitec and incorporates robust, compact model... » read more

Technologies For Power, Signal, Thermal And EMI Sign-off For Chip-Package-PCB Designs
By Various Writers - 03 Nov, 2011 - Comments: 0

Over the past few years, there has been a marked shift in the way people communicate and use computers. Some of the key changes include the prevalence of mobile internet connected devices such as smartphones and netbooks, the shift to cloud computing using larger centralized data centers, and the increase of electronics in automobiles for guidance, infotainment, and safety control systems. The ... » read more

SOI Conference Shows SOI Driving Key Roadmaps
By Various Writers - 21 Oct, 2011 - Comments: 0

By Adele Hars The 2011 IEEE SOI Conference, held in Tempe, AZ last week was not one to miss…but I did. Happily, I got the papers right away, along with observations shared by some of the folks who did get there. Highlights include excellent and insightful papers from ST, ARM, IBM, Intel, Leti, Peregrine and GlobalFoundries, plus many more that indicate SOI-based technologies are at th... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy