Blog Review: Dec. 15

Arm’s Hannah Peeler, Joshua Randall, and Zach Lasiuk examine the carbon cost of data centers and introduce a tool that allows users to make informed decisions about the carbon impact of their compute workloads.

Synopsys’ Kenneth Larsen provides a primer on the fundamentals of quantum computing, the role of photonics in building quantum systems, and the future potential impact on chip design.

Cadence’s Paul McLellan looks at the automotive semiconductor shortage and its impact on available features as well as on the used car market.

Siemens’ Katie Tormala argues that electronics manufacturers need to establish an integrated extended enterprise value chain built on an open ecosystem that fully integrates information flows and highly flexible processes.

Ansys’ Mona Michanek checks out how 5G uses both beamforming and MIMO techniques to maximize the scale and performance of cellular networks and the thermal and mechanical challenges in building phased array antennas for smartphones.

A Rambus writer checks out what’s new in PCIe 6.0 and how it achieves a doubling of rata rate to 64 gigatransfers per second through the use of PAM-4 signaling, forward error correction, and FLIT mode.

In a blog for SEMI, VLSI Research’s John West takes a look at what’s driving the growth of chillers, an often-overlooked fab component that has seen soaring revenue over the past five years.

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter:

Rambus’ John Eble foresees a 50% increase in data rates for server memory.

Ansys’ Kara Gremillion explains why roles, capabilities, and limitations are essential to finding the right combination of sensors for autonomous vehicles.

Arm’s Parag Beeraka shows how to enable local execution of inferencing tasks on streams of incoming video with 64-bit cameras.

Cadence’s Min Lei zeroes in on faster and more efficient interconnects with AMBA CHI.

Synopsys’ Godwin Maben digs into how to understand power consumption in the real world.

Siemens EDA’s Srinivas Velivala examines how to reduce potential correlation issues between the P&R fill and the signoff fill.