Blog Review: Feb. 22

The state of electric vehicles; improving machine learning efficiency; moving to EUV; power management history; embedded system design changes.


Mentor’s Brian Derrick digs into the state of the electric vehicle industry and whether established OEMs will be able to make the changes required to meet new consumer demands.

Cadence’s Paul McLellan listens in on how to greatly improve the efficiency of machine learning, without using custom hardware, in a talk by Stanford’s Kunle Olukotun.

Synopsys’ Robert Vamosi warns not to overlook seemingly-innocuous devices like printers when considering security.

GlobalFoundries’ Dave Lammers looks at moving from multiple patterning to EUV, boosting performance, and the challenge of interconnects at 7nm.

Sonics’ Randy Smith dives into the history of power management in IC designs and what led to the power challenges of today.

Intel’s Ron Wilson argues that the IoT is about to change the design of embedded systems – by changing the business models behind them.

Rambus’ Aharon Etengoff argues that the continued growth of data centers and high performance computing will require system designers to rethink traditional architectures

NXP’s Peter Schmallegger poses several questions about the future of credentials raised by the next generation of ePassport technology.

ARM’s Joseph Yiu looks at what IP components are required to create a small SoC based on a Cortex-M processor.

In a video, Cadence’s Nimrod Reiss discusses the challenges of verifying coherent interconnects, including snoop filtering, throughput and latency, and dealing with third-party interconnects.

Mentor’s Jeff Miller looks at the benefits of convergence and when it happens in IoT designs.

Plus, check out the blogs featured in last week’s Manufacturing & Process Technology newsletter:

Editor In Chief Ed Sperling contends that an explosion of data has changed how technology is used and prioritized.

Executive Editor Mark LaPedus argues that NOR remains viable amid a decline in growth.

SEMI’s Clark Tseng, Dan Tracy and Gavin Wang examine China’s growing appetite for equipment.

UMC’s Yan Qu digs into automotive chip manufacturing from a foundry perspective.

Mentor Graphics’ Vikas Gupta and Bhavani Prasad explain why fill is critical to reducing time-to-market at all process nodes.

Coventor’s Katherine Gambino looks at why virtual fabrication is so valuable in process modeling.

Semico Research’s Adrienne Downey notes that semiconductor sales growth is up slightly from 2016 and Intel, SK Hynix, Toshiba and Western Digital lead the pack.

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